10M08DAF256C8G
Informations
- Lifecycle
- Active
- Stock
- 3270 PCS
- Package
- LBGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Cette comparaison détaillée des composants 10M08DAF256C8G et 10M08DCF256A7G vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The 10M08DCF256A7G is a viable functional replacement candidate for the 10M08DAF256C8G in non-timing-critical designs, sharing the same Intel MAX 10 device family, 8,000-logic-element density, 256-ball FineLine BGA footprint, and single 1.2 V core supply. However, the faster A7 speed grade, wider commercial temperature range, and dual-configuration feature set of the DCF variant require validation against the target application's timing closure, thermal profile, and configuration scheme before final qualification.
Informations
Informations
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M08DAF256C8G | 10M08DCF256A7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 8,000 | 8,000 | Identical logic density ensures the same amount of programmable logic is available for the target design. |
| Embedded Memory | 378 Kbit | 378 Kbit | Matching on-chip memory capacity supports the same buffering, FIFO, and data storage requirements. |
| Package | 256-pin FBGA | 256-pin FBGA | The same package and pin count allow a drop-in board-level replacement without PCB redesign. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +125°C (Automotive/Industrial) | The wider temperature grade of the second device enables use in harsher environments but may affect cost and availability. |
| Speed Grade | 8 (Fastest) | 7 (Slower) | A different speed grade changes timing closure margins and maximum operating frequency, which can impact design performance. |
| Core Supply Voltage | 1.2 V | 1.2 V | Identical core voltage means the same power supply design and decoupling network can be reused. |
| Configuration Method | Instant-on (single-chip) | Instant-on (single-chip) | Both support non-volatile instant-on configuration, eliminating the need for external configuration memory. |
| RoHS Compliance | RoHS Compliant | RoHS Compliant | Both meet environmental regulations, ensuring they can be used in the same regulated markets. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M08DAF256C8G | 10M08DCF256A7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 500 | 500 |
| Number of Logic Elements/Cells | 8000 | 8000 |
| Total RAM Bits | 387072 | 387072 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 125°C (TJ) |
The 10M08DAF256C8G is a MAX 10 FPGA with 8,000 logic elements in a 256-pin FineLine BGA package, specified for commercial temperature range (0°C to 85°C junction) and speed grade 8. The 10M08DCF256A7G is also a MAX 10 FPGA with 8,000 logic elements in the same 256-pin FineLine BGA package, but it is specified for industrial temperature range (-40°C to 125°C junction) and speed grade 7. The primary differences are the temperature grade and speed grade.
Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel (Altera) MAX 10 device documentation. However, designers must verify that the configured I/O standards and dual-purpose pin assignments are compatible with the target application before substituting one for the other.
Not unconditionally. Although both are 8,000-logic-element MAX 10 FPGAs in the same 256-pin FBGA package, the 10M08DCF256A7G supports a wider industrial temperature range (-40°C to 125°C junction) and a faster speed grade (7) compared to the 10M08DAF256C8G (commercial temperature range 0°C to 85°C junction, speed grade 8). A drop-in replacement is only valid if the target design operates within the commercial temperature range and the timing closure is met with the slower speed grade 8 device.
Both devices feature 8,000 logic elements (LEs), 378 Kbits of M9K embedded memory, and 288 Kbits of user flash memory, as specified in the Intel MAX 10 device family datasheet. They also both include 2 analog-to-digital converter (ADC) blocks with 12-bit resolution and integrated temperature sensing capability.
The 10M08DAF256C8G is rated for the commercial temperature range with a junction temperature (Tj) of 0°C to 85°C. The 10M08DCF256A7G is rated for the industrial temperature range with a junction temperature (Tj) of -40°C to 125°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled-environment applications.
The 10M08DAF256C8G uses speed grade 8, which is the slower of the two. The 10M08DCF256A7G uses speed grade 7, which offers faster performance. In Intel MAX 10 nomenclature, a lower speed grade number indicates faster timing characteristics. Designers must run timing analysis with the specific speed grade to ensure their design meets setup and hold requirements.
Yes. Both the 10M08DAF256C8G and 10M08DCF256A7G are single-supply MAX 10 devices that support dual configuration from internal flash or external configuration sources. They both operate with a 3.0 V to 3.6 V VCC supply for I/O and a 1.15 V to 1.25 V VCCINT core supply, as documented in the Intel MAX 10 device datasheet. Both support instant-on configuration from internal flash memory.
The 10M08DCF256A7G should be selected for industrial applications requiring operation over the -40°C to 125°C junction temperature range. The 10M08DAF256C8G is only rated for 0°C to 85°C junction temperature and is not guaranteed to meet specifications outside that range. Using the commercial-grade device in an industrial environment may result in unreliable operation or reduced lifespan.