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10M08DAF256C8G
+NomenclatureIC FPGA 178 I/O 256FBGA
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FabricantInformations
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Pièce fabricant #10M08DAF256C8G
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Package 256-LBGA
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En stock3270
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 500 |
| NumberofLogicElements/Cells | 8000 |
| TotalRAMBits | 387072 |
| NumberofI/O | 178 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Présentation
Description
1. Logic Elements: It contains 8,000 logic elements, which are the building blocks for implementing custom digital circuits.
2. Package: The device is housed in a 256-pin FineLine BGA package, ensuring efficient package size and thermal performance.
3. Embedded Flash: It incorporates embedded flash memory, enabling single-chip, non-volatile configuration and storage without needing external memory.
4. Integrated Analog Functions: The FPGA includes integrated ADC (Analog-to-Digital Converter), simplifying the design for applications that require analog interfacing.
5. Low Power Consumption: The MAX 10 series is designed for low power operation, making it suitable for battery-powered and other energy-efficient applications.
6. I/O Flexibility: It supports a variety of I/O standards, allowing it to interface easily with other digital systems.
These features make the 10M08DAF256C8G an attractive choice for developers looking for a balance between performance, cost, and flexibility.
Equivalent
Features
1. Logic Elements (LEs): It contains 8,000 LEs, providing configurable logic blocks for digital circuit design.
2. Embedded Memory: Equipped with 387 Kbits of on-chip memory for efficient data storage and retrieval.
3. Integrated ADC: Features an 8-channel, 12-bit analog-to-digital converter for applications requiring analog interfacing.
4. Package Type: Housed in a 256-pin FineLine BGA package, optimizing for space-constrained environments.
5. Operating Temperature: Supports industrial temperature range (-40°C to 100°C), suitable for rugged conditions.
6. On-chip Oscillator: Includes an internal oscillator, reducing the need for external clock sources.
7. Non-volatile Configuration Memory: Retains configuration data even after power cycling, which simplifies system design.
8. Embedded Multipliers: Contains 24 embedded multipliers for DSP operations, enhancing computational efficiency.
9. Flexible I/O: Offers versatile I/O support, including LVDS and various voltage levels to interface with peripheral devices.
These features make the 10M08DAF256C8G versatile for applications in industrial, automotive, and consumer electronics domains.
Pinout
Key specifications include:
- 8,000 Logic Elements (LEs)
- Up to 378 Kbits of embedded memory
- Up to 144 Kbits of user flash memory
- Embedded multipliers for DSP applications
- Analog-to-digital converter (ADC) capabilities
- Support for various I/O standards
This FPGA is suitable for applications requiring a compact and low-power solution with flexible I/O and integrated features.
Manufacturer
Application
1. Industrial automation: Used in control systems and robotics due to its reliability and flexibility.
2. Consumer electronics: Powers devices requiring efficient processing.
3. Automotive systems: Supports advanced driver-assistance systems (ADAS) and infotainment.
4. Communications: Facilitates network processing and data management.
5. Medical devices: Provides processing for imaging and monitoring equipment.
6. IoT devices: Enhances connectivity and processing in smart devices.
7. Test and measurement equipment: Used for precision and customizable data handling.