Part A
10M08DAF256C8G
Informations
- Lifecycle
- Active
- Stock
- 3270 PCS
- Package
- LBGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M08DAF256C8GES is a functionally compatible replacement candidate for the 10M08DAF256C8G, sharing the same Intel MAX 10 FPGA family, 8,000 logic elements, 256-ball FineLine BGA package, and commercial temperature grade. The ES-suffix device is an engineering silicon variant intended for evaluation and prototyping; designers should validate timing closure, configuration flash behavior, and production sourcing before committing to volume deployment.
Logic Density
High match
Package Type
High match
Operating Temperature
High match
Production Status
Validation required
Parts at a glance
Part B
10M08DAF256C8GES
Informations
- Lifecycle
- Active
- Stock
- 6174 PCS
- Package
- LBGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M08DAF256C8G | 10M08DAF256C8GES | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, ensuring toolchain and IP compatibility. |
| Logic Elements (LEs) | 8000 | 8000 | Matching logic capacity allows equivalent design fit and resource utilization. |
| Embedded Memory | 378 kbit | 378 kbit | Identical on-chip memory supports the same buffering and storage requirements. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package ensures footprint and pinout compatibility for drop-in replacement. |
| Operating Temperature Range | 0°C to 85°C | 0°C to 85°C | Equivalent temperature range supports the same commercial application environments. |
| Supply Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | Same core voltage requirements allow identical power supply design. |
| Speed Grade | 8 | 8 | Identical speed grade ensures the same timing performance and Fmax characteristics. |
| Configuration Memory | Internal configuration flash | Internal configuration flash | Both are instant-on with integrated flash, simplifying system boot and board design. |
| RoHS Compliance | Compliant | Compliant | Both meet environmental regulations, allowing use in the same markets and applications. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M08DAF256C8G | 10M08DAF256C8GES |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Discontinued at Digi-Key |
| Number of LABs/CLBs | 500 | 500 |
| Number of Logic Elements/Cells | 8000 | 8000 |
| Total RAM Bits | 387072 | 387072 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What is the difference between the 10M08DAF256C8G and the 10M08DAF256C8GES?
The 10M08DAF256C8G is the standard industrial-grade Intel MAX 10 FPGA ordering code, while the 10M08DAF256C8GES is the same device supplied under an engineering sample (ES) ordering code. Both share the same package, speed grade, and temperature grade, but the ES version is intended for prototyping and evaluation rather than volume production.
Are the 10M08DAF256C8G and 10M08DAF256C8GES functionally identical?
Yes. Both ordering codes refer to the same MAX 10 10M08 device in a 256-ball FineLine BGA package with speed grade 8 and commercial temperature range. The ES suffix denotes engineering sample status, not a different silicon configuration.
Can the 10M08DAF256C8GES be used in production builds?
No. Engineering sample devices are not qualified for production use. Intel specifies ES parts for evaluation and prototyping only, and they should be replaced with the standard production ordering code, such as 10M08DAF256C8G, before volume manufacturing.
Do both devices use the same 256-ball FineLine BGA package?
Yes. Both the 10M08DAF256C8G and 10M08DAF256C8GES use the 256-ball FineLine BGA (FBGA) package with a 17 mm x 17 mm body and 1.0 mm ball pitch, so the PCB footprint and land pattern are identical.
What logic density and memory resources do these devices provide?
Both are based on the Intel MAX 10 10M08 device, which offers 8,000 logic elements (LEs), 378 Kbits of M9K embedded memory, and 288 Kbits of user flash memory. These parameters are identical for the standard and ES ordering codes.
Are the operating temperature ranges the same for both ordering codes?
Yes. The "C" in both ordering codes indicates the commercial temperature grade, which Intel specifies as 0°C to 85°C junction temperature for the MAX 10 10M08 device family.
Which device should be selected for a new design that has moved past the prototype stage?
The 10M08DAF256C8G should be selected for production. The 10M08DAF256C8GES is only appropriate during evaluation and prototyping, and Intel recommends transitioning to the standard ordering code before qualification and volume production.