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MTFC128GAOAMEA-WT
+NomenclatureIC FLASH 1TB MMC
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FabricantMicron Technology Co., Ltd.
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Pièce fabricant #MTFC128GAOAMEA-WT
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Package BGA
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En stock6249
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
Garantie produit authentique
Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | e•MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Tb (128G x 8) |
| Memory Interface | MMC |
| Operating Temperature | -25°C ~ 85°C (TA) |
Présentation
Description
A generic introduction (based on typical naming) would be:
- Memory IC (likely non‑volatile) with around 128 Mbit capacity.
- Interface could be SPI/QSPI or parallel, depending on the exact part.
- Typical voltages and features: read/write operations, possible block erase, ECC, security options, and low‑power modes.
- Common applications: code storage/boot memory, data logging, embedded system storage, automotive/industrial uses.
For a precise introduction, please share the manufacturer or a datasheet link. I can then summarize exact specs (capacity and organization, interface, timing, endurance/erase cycles, temp range, packaging).
Features
- Capacity: 128 Gbit (16 GB)
- Type: NAND flash (MLC/TLC family)
- Interface: ONFI-compatible parallel NAND or Toggle (I/O around 1.8–3.3 V)
- Endurance/Retry: P/E cycles in the low thousands (device‑dependent)
- Features: multi‑plane operation, bad-block management, wear leveling, ECC and firmware housekeeping
- Performance: sequential read/write in tens to hundreds of MB/s (device‑specific)
- Temperature: standard 0–70°C or wide (-40 to 85°C) versions
- Packaging: common configurations such as FBGA/TSOP with spare area
For precise, accurate features, please provide the datasheet or manufacturer.
Pinout
Manufacturer
- What kind of company: A US-based multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM, NAND/NOR flash, SSDs) for computing, mobile, enterprise, and embedded markets.
Application
- Embedded/mobile storage in smartphones/tablets
- Consumer electronics (digital cameras, set-top boxes)
- Automotive infotainment and telematics
- Industrial/IoT edge computing and control systems
- Data storage modules (SSDs, USB drives, memory cards)
Used wherever large-capacity non-volatile storage is needed, including harsher environments in automotive and industrial settings.