MT40A4G4NRE-083E:B

Images à titre indicatif uniquement

MT40A4G4NRE-083E:B

+Nomenclature

IC DRAM 16GBIT PARALLEL 78FBGA

  • FabricantMicron Technology Co., Ltd.

  • Pièce fabricant #MT40A4G4NRE-083E:B

  • Package TFBGA-78

  • En stock8818

365 Garantie qualité 24h/24

7*24 Garantie de service 24h/24

90-Garantie après-vente 24h/24

Garantie produit authentique

Spécifications

Attribut Valeur
Package / Case Tray
Part Status Obsolete
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR4
Memory Size 16Gb (4G x 4)
Memory Interface Parallel
Clock Frequency 1.2 GHz
Voltage - Supply 1.14V ~ 1.26V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount

Présentation

Description

MT40A4G4NRE-083E:B is a Micron Technology DRAM device. It denotes a single memory die with 4 gigabits of density and a 4-bit wide I/O (4G4). It is part of Micron’s MT40A4G4NRE family and is used as the DRAM component on memory modules (DIMMs/SODIMMs) or other systems requiring DRAM. The suffixes -083E and :B indicate a specific speed/voltage grade and a packaging/variant option within that family. In short, it’s not a complete module but a DRAM die with defined timing, voltage, and form-factor per the datasheet. For exact electrical specs (voltage, timings, supported speeds), consult the MT40A4G4NRE-083E:B datasheet from Micron.

Pinout

- Pin count: 96 pins (96-ball FBGA package)
- Function: MT40A4G4NRE-083E:B is a Micron DDR3L SDRAM device with a 4 Gb capacity and x4 data width (4-bit data path). It uses a standard DDR3L interface with inputs/outputs for address and control (A0–A12, BA0–BA2, /RAS, /CAS, /WE, /CS, CKE), clocks (CK/CK#), data I/O (DQ[3:0]) and strobes (DQS/DQS#), data mask (DM), along with power/ground pins (Vcc/Vss, Vref, ZQ).

Manufacturer

Manufacturer: Micron Technology, Inc.
What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage solutions (DRAM, NAND, NOR flash, SSDs, etc.).

Application

MT40A4G4NRE-083E:B is a Micron DRAM device used in high-density memory subsystems. Common application areas include:
- Server and data-center memory modules
- Desktop and notebook computers (DIMMs)
- Networking and telecom equipment (switches/routers)
- Embedded, industrial, and automotive systems requiring DRAM
- Graphics, workstation, and high-performance computing applications
It serves as a general-purpose high-density memory component in various computing platforms.

Package

96-ball FBGA package.

Produits liés à MT40A4G4NRE-083E:B

  • Devis rapide

  • Envoyez votre demande de devis pour MT40A4G4NRE-083E:B Utilisez ce formulaire. Nous vous répondrons sous 12 heures.