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CSD19537Q3
+NomenclatureMOSFET N-CH 100V 9.7A/50A 8VSON
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FabricantTexas Instruments
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Pièce fabricant #CSD19537Q3
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Package TDFN-8
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En stock6818
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Spécifications
| Attribut | Valeur |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| Part Status | Active |
| FET Type | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 100 V |
| Current - Continuous Drain(Id) @ 25°C | 50A (Ta) |
| Drive Voltage(Max Rds On Min Rds On) | 6V, 10V |
| Rds On(Max) @ Id Vgs | 14.5mOhm @ 10A, 10V |
| Vgs(th)(Max) @ Id | 3.6V @ 250µA |
| Gate Charge(Qg)(Max) @ Vgs | 21 nC @ 10 V |
| Vgs(Max) | ±20V |
| Input Capacitance(Ciss)(Max) @ Vds | 1680 pF @ 50 V |
| Power Dissipation (Max) | 2.8W (Ta), 83W (Tc) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 8-VSON (3.3x3.3) |
Présentation
Description
If CSD19537Q3 is a computer science course, it could cover topics such as programming, algorithms, data structures, or other fundamental areas in the field. Courses at this level may involve lectures, practical lab sessions, and assessments like exams or projects.
If you have more specific information about the course or its context, such as a syllabus or a description from a course catalog, that would help in providing a more tailored introduction. Otherwise, I recommend checking with the educational institution offering the course for precise details.
Equivalent
1. IRF7343 - from Infineon Technologies
2. NTMFS5C628NL - from ON Semiconductor
3. FDMC86102 - from ON Semiconductor (formerly Fairchild)
4. SiR462DP - from Vishay
While these may offer similar performance, always verify the parameters like voltage, current ratings, and package compatibility before substitution.
Pinout
- Pin Count: The CSD19537Q3 comes in a 3x3 mm SON (Small Outline No-lead) package, which typically features 8 pins.
- Pin Functions:
- Gate (G): Controls the operation of the MOSFET. Applying a voltage here allows current to flow between the drain and source.
- Drain (D): The terminal where the load current enters the MOSFET.
- Source (S): The terminal where the load current exits the MOSFET.
- Thermal Pad: Located on the underside of the package, it is used for heat dissipation and is typically connected to the source terminal for better thermal performance.
This compact design allows for efficient switching and thermal management, making it suitable for various high-frequency applications. Always refer to the specific datasheet for detailed electrical characteristics and pin configuration.