Part A
10M16DAF256I7G
Informations
- Lifecycle
- Active
- Stock
- 6815 PCS
- Package
- BGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256I7G and 10M16DCF484I7G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic elements, core architecture, and industrial temperature grade, making them functionally comparable in logic capacity and operating conditions. However, they differ in package type and pin count, which affects PCB footprint and pinout compatibility. The 10M16DAF256I7G uses a 256-ball FineLine BGA package, while the 10M16DCF484I7G uses a 484-ball FineLine BGA package. This difference in physical package and I/O count means the two devices are not pin-to-pin drop-in replacements, and a board redesign or adapter would be required for substitution. Designers should verify I/O requirements, power delivery, and configuration scheme compatibility before considering a swap.
Logic Density
High match
Package Type
Not compatible
Operating Temperature
High match
I/O Count
Validation required
Parts at a glance
Part B
10M16DCF484I7G
Informations
- Lifecycle
- Active
- Stock
- 9315 PCS
- Package
- BGA-484
- Series
- FPGA embarqué (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256I7G | 10M16DCF484I7G | Why it matters |
|---|---|---|---|
| Package / Case | 256-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | The package determines the PCB footprint, pin count, and available I/O, so a different package prevents direct drop-in replacement. |
| Number of I/O Pins | 178 | 346 | Available user I/O directly limits how many external signals the device can interface with, affecting system connectivity. |
| Total RAM Bits | 562176 | 562176 | Embedded memory capacity affects the ability to buffer data and implement on-chip storage for DSP and logic functions. |
| Number of Logic Elements / Cells | 16000 | 16000 | Logic element count defines the amount of programmable logic available for implementing custom digital functions. |
| Number of LABs / CLBs | 1000 | 1000 | Logic array blocks determine the granularity and efficiency of logic placement and routing within the FPGA fabric. |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | The temperature range must match the target application environment to ensure reliable operation and timing closure. |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V | Core supply voltage must be compatible with the board power design to avoid damage or unreliable operation. |
| Mounting Type | Surface Mount | Surface Mount | Mounting type determines the assembly process and whether the part is compatible with the existing PCB manufacturing flow. |
| Speed Grade | 7 (Fastest Commercial) | 7 (Fastest Commercial) | Speed grade affects maximum operating frequency and timing margins, which are critical for meeting performance targets. |
| Supplier Device Package | 256-FBGA (17x17) | 484-FBGA (23x23) | The physical package dimensions and ball pitch affect board layout, routing density, and mechanical fit. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256I7G | 10M16DCF484I7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256I7G and the 10M16DCF484I7G?
The primary differences are package type, pin count, and I/O availability. The 10M16DAF256I7G uses a 256-pin FineLine BGA (FBGA) package, while the 10M16DCF484I7G uses a 484-pin FineLine BGA package. Both devices share the same 16,000-logic-element MAX 10 FPGA die, but the larger 484-pin package provides more user I/O pins and additional features such as higher transceiver and ADC channel availability.
Do the 10M16DAF256I7G and 10M16DCF484I7G have the same logic density and core architecture?
Yes. Both are Intel MAX 10 family FPGAs with 16,000 logic elements (LEs), the same core architecture, and identical embedded memory and DSP block resources. The differences are limited to package, pin count, I/O count, and the associated feature set exposed by the larger package.
Are the 10M16DAF256I7G and 10M16DCF484I7G pin-to-pin compatible?
No. The 10M16DAF256I7G is a 256-pin FBGA package and the 10M16DCF484I7G is a 484-pin FBGA package. They have different physical dimensions, ball counts, and ball maps, so they are not drop-in replacements and require different PCB footprints.
What does the "I7" speed grade indicate for both devices?
The "I7" suffix indicates an industrial temperature grade with a speed grade of 7. Both the 10M16DAF256I7G and 10M16DCF484I7G are specified for industrial temperature operation and share the same speed grade, so their timing performance is equivalent when placed in the same operating conditions.
Which device offers more user I/O pins, the 10M16DAF256I7G or the 10M16DCF484I7G?
The 10M16DCF484I7G offers more user I/O pins because it uses the larger 484-pin FBGA package. The 10M16DAF256I7G, with its 256-pin FBGA package, provides a lower maximum user I/O count. Designers needing more I/O should select the 484-pin variant.
Can the 10M16DAF256I7G be used as a substitute for the 10M16DCF484I7G in an existing design?
No, not directly. Although both share the same 16,000-LE MAX 10 FPGA core, the different package sizes, pin counts, and ball maps mean the PCB footprint and pin assignments differ. A redesign or adapter would be required, and all I/O, power, and configuration pin differences must be validated against Intel documentation.
Do both devices support the same configuration and embedded features such as ADC and flash?
Both are MAX 10 devices with integrated configuration flash and analog-to-digital converter (ADC) blocks. However, the number of ADC channels and certain embedded features exposed depends on the package. The 484-pin variant typically makes more ADC channels and I/O available than the 256-pin variant. Exact channel counts should be confirmed in the respective Intel MAX 10 device pin-out files.
Which package is better for space-constrained designs, the 10M16DAF256I7G or the 10M16DCF484I7G?
The 10M16DAF256I7G is better for space-constrained designs because its 256-pin FBGA package is physically smaller than the 484-pin FBGA package of the 10M16DCF484I7G. The trade-off is reduced I/O count and fewer exposed features compared to the larger package.