Part A
10M16DAF256I7G
Informations
- Lifecycle
- Active
- Stock
- 6815 PCS
- Package
- BGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256I7G and 10M16DAF484C7G are functionally compatible as they share the same Intel MAX 10 FPGA family, 16,000 logic elements, and core architecture, but they differ in package type, pin count, and operating temperature grade. The 10M16DAF484C7G offers a larger 484-pin FBGA package with more user I/O and a commercial temperature range, while the 10M16DAF256I7G provides a compact 256-pin FBGA package with industrial temperature support. Designers must validate pinout, I/O count, and thermal requirements before substituting.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Validation required
I/O Count
Validation required
Parts at a glance
Part B
10M16DAF484C7G
Informations
- Lifecycle
- Active
- Stock
- 6583 PCS
- Package
- BGA-484
- Series
- FPGA embarqué (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256I7G | 10M16DAF484C7G | Why it matters |
|---|---|---|---|
| Package / Case | 256-FBGA (17x17) | 484-FBGA (23x23) | Different package footprint and ball count directly affect PCB layout, routing, and mechanical fit, so the two devices are not drop-in replacements. |
| Number of I/Os | 178 | 320 | Available user I/O determines how many peripherals and interfaces can be connected; the 484-pin device offers substantially more I/O. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | The industrial-grade temperature range of the I7G part supports harsher environments, while the commercial-grade C7G part is limited to standard conditions. |
| Speed Grade | 7 (industrial) | 7 (commercial) | Speed grade affects maximum operating frequency and timing closure; both are grade 7 but differ in temperature qualification. |
| Logic Elements (LEs) | 16000 | 16000 | Identical logic capacity means both devices can implement the same logic functions, but package and I/O differences still prevent direct substitution. |
| Total RAM Bits | 562176 | 562176 | Equal embedded memory resources allow similar data buffering and storage within the FPGA fabric. |
| Number of PLLs | 4 | 4 | Same number of phase-locked loops supports comparable clock generation and management capabilities. |
| Supply Voltage | 1.15V to 1.25V | 1.15V to 1.25V | Identical core voltage requirements mean the same power supply design can be used for both devices. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256I7G | 10M16DAF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256I7G and the 10M16DAF484C7G?
The primary differences are package type, pin count, and speed grade. The 10M16DAF256I7G is in a 256-pin FineLine BGA package with an industrial temperature grade (I7), while the 10M16DAF484C7G is in a 484-pin FineLine BGA package with a commercial temperature grade (C7). Both are Intel (Altera) MAX 10 FPGA devices with 16,000 logic elements.
Are the 10M16DAF256I7G and 10M16DAF484C7G functionally interchangeable?
No, they are not directly interchangeable. The different package sizes (256 vs 484 pins) result in different pin counts, I/O availability, and PCB footprint requirements. Additionally, the speed grade and temperature grade differ, which affects timing performance and operating temperature range.
What is the logic density of both the 10M16DAF256I7G and 10M16DAF484C7G?
Both devices feature 16,000 logic elements (LEs), which is the defining characteristic of the MAX 10 10M16 family. They also share the same embedded memory, DSP blocks, and analog-to-digital converter (ADC) capabilities as part of the MAX 10 device architecture.
What do the speed grade and temperature grade suffixes indicate for these two parts?
The 10M16DAF256I7G has an "I7" suffix, indicating an industrial temperature grade (typically -40°C to +100°C junction temperature) and speed grade 7. The 10M16DAF484C7G has a "C7" suffix, indicating a commercial temperature grade (typically 0°C to +85°C junction temperature) and speed grade 7. Both use the same speed grade but differ in temperature range.
Can the 10M16DAF484C7G be used as a drop-in replacement for the 10M16DAF256I7G?
No. The 484-pin package is physically larger and has a different ball grid array footprint than the 256-pin package. A board designed for the 256-pin device cannot accept the 484-pin device without a redesign. Additionally, the commercial temperature grade of the 484C7G may not meet the industrial temperature requirements of the 256I7G application.
Do both devices support the same configuration methods, such as internal configuration flash?
Yes. Both the 10M16DAF256I7G and 10M16DAF484C7G are MAX 10 FPGAs featuring integrated dual-configuration flash memory. They support instant-on configuration and can be configured via JTAG, active serial, or internal configuration without external flash memory.
Which device offers more user I/O pins, the 10M16DAF256I7G or the 10M16DAF484C7G?
The 10M16DAF484C7G offers more user I/O pins due to its larger 484-pin package. The 256-pin package of the 10M16DAF256I7G provides fewer I/O pins. The exact I/O count depends on the specific package and device variant, and should be verified in the Intel MAX 10 device pin-out documentation.
Are both devices RoHS compliant and lead-free?
Yes. Both the 10M16DAF256I7G and 10M16DAF484C7G are offered in RoHS-compliant, lead-free packages as standard Intel FPGA products. The "G" suffix in both part numbers indicates RoHS compliance and lead-free construction.