XR819

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  • FabricantComposants jlcpcb

  • Pièce fabricant #XR819

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Spécifications

Attribut Valeur
Manufacturer JLCPCB Assembly
Package QFN-40_L5.0-W5.0-P0.40-EP3.3

Présentation

Description

The XR819 is a low-power, highly integrated Wi-Fi SoC (System on Chip) designed for IoT and embedded applications. Developed by Xradio Technology, it supports 802.11 b/g/n Wi-Fi (2.4 GHz) and features:
- Low power consumption (ideal for battery-powered devices).
- Compact size (QFN-32 package).
- Integrated RF, MAC, and baseband processor.
- Supports SDIO and SPI interfaces for host communication.
- Embedded TCP/IP stack for simplified networking.
Commonly used in smart home devices, wearables, and industrial IoT, the XR819 offers a cost-effective Wi-Fi solution with minimal external components. It is often paired with microcontrollers (e.g., ARM Cortex-M series) to enable wireless connectivity.
Key advantages:
✔ Low cost
✔ Small footprint
✔ Energy-efficient
Limitations:
✖ Limited to 2.4 GHz
✖ No Bluetooth support
For more details, refer to the XR819 datasheet or Xradio’s official documentation.

Equivalent

The XR819 is a low-power Wi-Fi chip. Equivalent alternatives include:
- ESP8266 (by Espressif)
- ESP32 (more advanced, dual-core)
- RTL8710BX (by Realtek)
- CYWF6935 (by Cypress/Infineon)
- ATWINC1500 (by Microchip)
These chips offer similar Wi-Fi connectivity with varying power, performance, and feature sets. Choose based on your specific needs (e.g., power efficiency, processing power, or cost).

Features

The XR819 is a low-power Wi-Fi SoC (System on Chip) designed for IoT applications. Key features include:
- Wi-Fi Standard: 802.11 b/g/n (2.4 GHz)
- Low Power: Supports sleep modes for battery efficiency
- Integrated MCU: Built-in ARM Cortex-M3 processor
- Interfaces: UART, SPI, I2C, PWM, GPIO
- Security: Supports WEP, WPA, WPA2 encryption
- Small Footprint: Compact design for space-constrained devices
- OS Support: Works with FreeRTOS and other RTOS
- Applications: Smart home, wearables, industrial IoT
It’s commonly used in devices requiring reliable, low-power Wi-Fi connectivity.

Pinout

The XR819 is a low-power Wi-Fi SoC (System on Chip) designed for IoT applications.
Pin Count: 32-pin (QFN package).
Key Functions:
- Wi-Fi Connectivity: Supports 2.4GHz 802.11b/g/n.
- Interfaces: Includes SPI, SDIO, UART, I2C, and GPIO for peripheral connections.
- Low Power: Optimized for battery-operated devices.
- Integrated Features: Built-in RF front-end, MAC, baseband, and power management.
It is commonly used in smart home devices, wearables, and other embedded systems.

Manufacturer

The XR819 is a Wi-Fi and Bluetooth combo chip manufactured by Xradio Technology, a Chinese semiconductor company.
Xradio Technology specializes in wireless communication chips, focusing on low-power, cost-effective solutions for IoT and consumer electronics. Their products are commonly used in smart home devices, wearables, and other embedded systems.
The company is known for integrating Wi-Fi (2.4GHz) and Bluetooth (4.2/5.0) in compact designs, targeting budget-friendly applications. While not as prominent as global leaders like Qualcomm or Broadcom, Xradio serves niche markets, particularly in China.
In summary:
- Manufacturer: Xradio Technology
- Company Type: Chinese semiconductor firm specializing in wireless IoT chips.
- Key Features: Low-power, integrated Wi-Fi/Bluetooth solutions for cost-sensitive devices.

Application

The XR819 is a low-power Wi-Fi chip primarily used in IoT and embedded applications. Key application areas include:
1. Smart Home Devices – Smart plugs, lights, and sensors.
2. Wearables – Fitness trackers and health monitors.
3. Industrial IoT – Remote monitoring and control systems.
4. Consumer Electronics – Wireless peripherals and portable gadgets.
5. Automotive – In-vehicle connectivity for diagnostics and infotainment.
Its low power consumption and compact design make it ideal for battery-operated and space-constrained devices.

Package

The XR819 is a Wi-Fi and Bluetooth combo chip, typically available in a QFN (Quad Flat No-leads) package. Common variants include the QFN-32 package, which measures around 5mm x 5mm, suitable for compact IoT and embedded applications. The package type ensures efficient thermal performance and space-saving integration. For exact specifications, refer to the manufacturer's datasheet.