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XCZU15EG-1FFVC900E
+NomenclatureIC SOC CORTEX-A53 900FCBGA
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FabricantAMD Xilinx
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Pièce fabricant #XCZU15EG-1FFVC900E
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Package FBGA-900
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En stock5002
365 Garantie qualité 24h/24
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Présentation
Description
The XCZU15EG-1FFVC900E features robust connectivity options, including multiple 12.5G transceivers, a wide array of I/O ports, and support for high-speed memory interfaces like DDR4. It is housed in a 900-pin flip-chip BGA package and offers a balance of performance, power efficiency, and scalability. The device is supported by Xilinx's Vivado Design Suite, which simplifies development and deployment. Overall, the XCZU15EG-1FFVC900E provides a flexible and powerful solution for integrating software programmability, real-time processing, and hardware versatility into a single device.
Equivalent
1. Intel Stratix 10 family (e.g., 10ST050)
2. Microchip PolarFire SoC (e.g., MPFS250T-FCVG484E)
3. Altera Arria 10 SoC (e.g., 10AS066H2F34E3SG)
These alternatives offer varying degrees of performance and features aimed at similar high-performance, embedded system applications. Ensure compatibility with your specific project requirements when selecting an equivalent.
Features
Pinout
Key features of the XCZU15EG include:
1. Processing System (PS):
- Quad-core ARM Cortex-A53 processors.
- Dual-core ARM Cortex-R5 real-time processors.
- ARM Mali-400 MP2 graphics processor.
2. Programmable Logic (PL):
- Offers a considerable amount of LUTs, flip-flops, and DSP slices for custom logic implementations.
3. I/O and Connectivity:
- Supports a wide array of I/O standards.
- High-speed serial transceivers for advanced data communication.
4. Memory:
- Integrated memory controllers supporting DDR4, DDR3, LPDDR4, and LPDDR3.
The integration of these systems allows for versatile design options in applications such as embedded systems, automotive, telecommunications, and industrial automation.
Manufacturer
Xilinx's products are widely used across various industries including telecommunications, automotive, aerospace, data centers, and consumer electronics, among others. The company's technology enables hardware designers to create and deploy complex digital systems with high levels of flexibility and performance optimization.
Founded in 1984, Xilinx was an independent company until its acquisition by Advanced Micro Devices, Inc. (AMD) in February 2022. As part of AMD, Xilinx continues to operate as a leader in high-performance, adaptive, and intelligent computing. The company is headquartered in San Jose, California, and has a global presence with offices and facilities in various countries.
Application
1. Embedded Vision Systems: For real-time image and video processing.
2. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
3. Telecommunications: 5G wireless communication infrastructure.
4. Industrial Automation: Control systems and robotics.
5. Medical Devices: Imaging and diagnostic equipment.
6. Aerospace and Defense: Radar and secure communication systems.
Its heterogeneous architecture, combining ARM processors with FPGA fabric, makes it ideal for applications requiring intensive processing and high integration.