XCVU13P-2FLGA2577I

Images à titre indicatif uniquement

XCVU13P-2FLGA2577I

+Nomenclature

IC FPGA 448 I/O 2577FCBGA

  • FabricantAMD Xilinx

  • Pièce fabricant #XCVU13P-2FLGA2577I

  • Package FBGA-2577

  • En stock1502

365 Garantie qualité 24h/24

7*24 Garantie de service 24h/24

90-Garantie après-vente 24h/24

Garantie produit authentique

Spécifications

Attribut Valeur
Package / Case Tray
Series Virtex® UltraScale+™
Part Status Active
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 448
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Présentation

Description

The XCVU13P-2FLGA2577I is part of the Xilinx Virtex UltraScale+ FPGA family, designed for high-performance computing and advanced system processing tasks. This Field Programmable Gate Array (FPGA) model excels in scenarios requiring high throughput and low latency, such as data centers, telecommunications, and complex scientific computations.
Key features include:
1. High Logic Density: It offers a significant number of logic cells, allowing for complex algorithm implementation and parallel processing.
2. Advanced Memory: The FPGA includes large on-chip memory resources, enabling efficient data handling and storage.
3. I/O Flexibility: With numerous high-speed I/O pins, it supports various communication protocols and high bandwidth.
4. Power Efficiency: Despite its powerful capabilities, it is designed for energy efficiency, crucial for large-scale operations.
5. Scalability and Customizability: The programmable nature of FPGAs allows designers to tailor functions specifically to their application's needs, providing scalability for future upgrades.
The XCVU13P-2FLGA2577I is ideal for industries where speed, power, and adaptability are critical.

Equivalent

The XCVU13P-2FLGA2577I is a Xilinx Virtex UltraScale+ FPGA. Equivalent products may include offerings from other FPGA manufacturers like Intel (formerly Altera), such as the Stratix 10 series, or products from Microsemi (Microchip) like the PolarFire series. However, exact equivalents depend on specific requirements like logic cells, clock speed, and I/O count. It's essential to compare specific technical specifications to determine a suitable alternative.

Features

The XCVU13P-2FLGA2577I is a field-programmable gate array (FPGA) from the Xilinx Virtex UltraScale+ series. This FPGA is designed for high-performance applications and offers the following features:
1. High Logic Capacity: It delivers significant logic density, making it suitable for complex computational tasks.
2. Advanced DSP Blocks: Contains numerous DSP slices for efficient signal processing.
3. UltraRAM: Provides embedded memory blocks for high-speed data storage and retrieval.
4. Transceivers: Equipped with high-speed transceivers supporting data rates for communication applications.
5. Scalability and Flexibility: The architecture allows for custom configuration, supporting various applications from data centers to wireless infrastructure.
6. Power Efficiency: Designed with advanced power management features to reduce energy consumption.
7. Enhanced I/O Features: Supports high-performance I/O standards and multiple protocols.
8. Security Features: Incorporates hardware security features to protect intellectual property and data integrity.
This FPGA is typically used in applications requiring robust, high-speed processing capabilities such as telecommunications, high-performance computing, and advanced data analytics.

Pinout

The XCVU13P-2FLGA2577I is a member of the Xilinx Virtex UltraScale+ FPGA family. It comes in an FLGA (flip-chip land grid array) package with a pin count of 2,577.
This FPGA is designed for high-performance applications with extensive logic and DSP resources, making it suitable for data center, networking, and advanced communication systems. Key functions include:
1. Logic Cells: Provides a large number of configurable logic blocks for custom digital circuit implementation.
2. DSP Slices: Contains specialized DSP blocks for high-speed arithmetic operations, crucial for signal processing tasks.
3. Memory: Includes various types of embedded RAM blocks like block RAM and UltraRAM for efficient data storage and access.
4. I/O and Transceivers: Features high-speed I/O pins and multi-gigabit transceivers for data communication and interface with other devices.
5. Network on Chip (NoC): Supports integrated NoC for high-bandwidth data movement within the chip architecture.
6. Power Management: Offers dynamic power management capabilities to optimize energy consumption.
These features make it highly versatile for complex and high-throughput computing tasks.

Manufacturer

The XCVU13P-2FLGA2577I is manufactured by Xilinx, Inc. Xilinx is a company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs), system on chips (SoCs), and adaptive compute acceleration platforms (ACAPs). Founded in 1984, Xilinx was a pioneer in the invention of FPGAs, which are integrated circuits that can be configured by the customer or designer after manufacturing, allowing for customized hardware functionality.
Xilinx's products are widely used in various industries such as telecommunications, automotive, aerospace, defense, industrial, and data centers. The company's technologies enable advancements in areas like artificial intelligence, machine learning, and 5G communications. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a leading company in the semiconductor industry, known for its processors and graphics technologies. This acquisition has allowed AMD to expand its product offerings and address a broader range of markets with enhanced computing solutions.

Application

The XCVU13P-2FLGA2577I is a Virtex UltraScale+ FPGA from Xilinx, designed for high-performance and compute-intensive applications. Key application areas include:
1. Data Centers: Accelerating data processing and networking tasks.
2. Wireless Communications: Supporting 5G infrastructure and massive MIMO systems.
3. Broadcast and Pro AV: Handling video processing, including 4K/8K video streaming.
4. Defense and Aerospace: Implementing secure communications and sensor fusion systems.
5. High-Performance Computing: Enabling advanced computing applications in scientific research.
6. Finance: Powering high-frequency trading platforms with low-latency processing.
Its high logic density and advanced I/O capabilities make it suitable for these complex, data-intensive environments.

Package

The XCVU13P-2FLGA2577I is a field-programmable gate array (FPGA) from Xilinx's Virtex UltraScale+ series. The package type "FLGA2577" indicates a Flip-Chip Land Grid Array with 2,577 connections, and the "I" denotes an industrial temperature grade.

Produits liés à XCVU13P-2FLGA2577I