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XCVU13P-2FLGA2577I
+NomenclatureIC FPGA 448 I/O 2577FCBGA
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FabricantAMD Xilinx
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Pièce fabricant #XCVU13P-2FLGA2577I
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Package FBGA-2577
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En stock1502
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 216000 |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 514867200 |
| Number of I/O | 448 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Présentation
Description
Key features include:
1. High Logic Density: It offers a significant number of logic cells, allowing for complex algorithm implementation and parallel processing.
2. Advanced Memory: The FPGA includes large on-chip memory resources, enabling efficient data handling and storage.
3. I/O Flexibility: With numerous high-speed I/O pins, it supports various communication protocols and high bandwidth.
4. Power Efficiency: Despite its powerful capabilities, it is designed for energy efficiency, crucial for large-scale operations.
5. Scalability and Customizability: The programmable nature of FPGAs allows designers to tailor functions specifically to their application's needs, providing scalability for future upgrades.
The XCVU13P-2FLGA2577I is ideal for industries where speed, power, and adaptability are critical.
Equivalent
Features
1. High Logic Capacity: It delivers significant logic density, making it suitable for complex computational tasks.
2. Advanced DSP Blocks: Contains numerous DSP slices for efficient signal processing.
3. UltraRAM: Provides embedded memory blocks for high-speed data storage and retrieval.
4. Transceivers: Equipped with high-speed transceivers supporting data rates for communication applications.
5. Scalability and Flexibility: The architecture allows for custom configuration, supporting various applications from data centers to wireless infrastructure.
6. Power Efficiency: Designed with advanced power management features to reduce energy consumption.
7. Enhanced I/O Features: Supports high-performance I/O standards and multiple protocols.
8. Security Features: Incorporates hardware security features to protect intellectual property and data integrity.
This FPGA is typically used in applications requiring robust, high-speed processing capabilities such as telecommunications, high-performance computing, and advanced data analytics.
Pinout
This FPGA is designed for high-performance applications with extensive logic and DSP resources, making it suitable for data center, networking, and advanced communication systems. Key functions include:
1. Logic Cells: Provides a large number of configurable logic blocks for custom digital circuit implementation.
2. DSP Slices: Contains specialized DSP blocks for high-speed arithmetic operations, crucial for signal processing tasks.
3. Memory: Includes various types of embedded RAM blocks like block RAM and UltraRAM for efficient data storage and access.
4. I/O and Transceivers: Features high-speed I/O pins and multi-gigabit transceivers for data communication and interface with other devices.
5. Network on Chip (NoC): Supports integrated NoC for high-bandwidth data movement within the chip architecture.
6. Power Management: Offers dynamic power management capabilities to optimize energy consumption.
These features make it highly versatile for complex and high-throughput computing tasks.
Manufacturer
Xilinx's products are widely used in various industries such as telecommunications, automotive, aerospace, defense, industrial, and data centers. The company's technologies enable advancements in areas like artificial intelligence, machine learning, and 5G communications. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a leading company in the semiconductor industry, known for its processors and graphics technologies. This acquisition has allowed AMD to expand its product offerings and address a broader range of markets with enhanced computing solutions.
Application
1. Data Centers: Accelerating data processing and networking tasks.
2. Wireless Communications: Supporting 5G infrastructure and massive MIMO systems.
3. Broadcast and Pro AV: Handling video processing, including 4K/8K video streaming.
4. Defense and Aerospace: Implementing secure communications and sensor fusion systems.
5. High-Performance Computing: Enabling advanced computing applications in scientific research.
6. Finance: Powering high-frequency trading platforms with low-latency processing.
Its high logic density and advanced I/O capabilities make it suitable for these complex, data-intensive environments.