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XCVU13P-2FHGA2104E
+NomenclatureIC FPGA 832 I/O 2104FCBGA
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FabricantAMD Xilinx
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Pièce fabricant #XCVU13P-2FHGA2104E
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Package FBGA-2104
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En stock7450
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 216000 |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 514867200 |
| Number of I/O | 832 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Présentation
Description
Key features of the XCVU13P-2FHGA2104E include a substantial amount of logic cells, a plethora of DSP slices for signal processing tasks, and high-bandwidth memory interfaces. This FPGA model supports advanced high-speed transceivers, making it ideal for tasks requiring rapid data transfer. It also benefits from improved power efficiency, which is crucial for large-scale and power-sensitive applications.
The "2FHGA2104E" suffix typically refers to the specific package and speed grade, with the package size and pin count denoted by "FHGA2104." This specific configuration is designed to fit advanced engineering requirements, balancing processing power with integration capabilities for demanding applications.
Equivalent
1. Intel's Stratix 10 series, such as the Stratix 10 GX.
2. Lattice's CrossLink-NX series for specific applications.
3. Other Xilinx products in the same family but with different specifications.
These alternatives vary based on specific requirements like logic cells, memory, and power consumption. Always compare the specifications closely to ensure they meet your needs.
Features
1. Architecture: Built on UltraScale+ architecture, which enhances system integration capabilities and performance.
2. Logic Cells: It features a large number of logic cells, providing extensive capability for complex designs.
3. Transceivers: High-speed serial transceivers support high-bandwidth data transmission, essential for advanced communication protocols.
4. Memory: Includes a substantial amount of on-chip memory, such as block RAM and UltraRAM, which improves data throughput and processing.
5. DSP Slices: Equipped with numerous DSP slices for efficient implementation of arithmetic functions, crucial for high-performance computing tasks.
6. I/O Standards: Supports a wide range of I/O standards and high-speed connectivity options facilitating diverse application integration.
7. Power Efficiency: Designed with power-efficient features suitable for data centers and other energy-sensitive applications.
8. Application Suitability: Ideal for applications requiring high performance, such as 5G wireless, data center acceleration, and machine learning.
These features make it suitable for demanding applications that require high computational power and flexibility.
Pinout
Manufacturer
Xilinx was a pioneer in the FPGA industry, and its products are known for their innovation and excellence in providing flexible and adaptable solutions for complex computing needs. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading semiconductor company that focuses on high-performance computing, graphics, and visualization technologies. However, Xilinx continues to operate as a subsidiary under AMD, maintaining its focus on developing programmable devices and solutions.
Application
1. High-Performance Computing: For data centers requiring accelerated processing capabilities.
2. Telecommunications: In 5G networks for signal processing and data throughput.
3. Aerospace and Defense: For secure and efficient processing in radar and communication systems.
4. Broadcast and Pro AV: For video processing and high-resolution display technologies.
5. Automotive: In advanced driver-assistance systems (ADAS) for real-time data analysis.
6. Artificial Intelligence and Machine Learning: Used in AI inference applications for its parallel processing capabilities.
These applications leverage the FPGA's high speed, parallel processing, and configurability.