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XCKU040-2SFVA784E
+NomenclatureIC FPGA 468 I/O 784FCBGA
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FabricantAMD Xilinx
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Pièce fabricant #XCKU040-2SFVA784E
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Package FBGA-784
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En stock4798
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Spécifications
| Attribut | Valeur |
| Package / Case | Bulk |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 30300 |
| Number of Logic Elements/Cells | 530250 |
| Total RAM Bits | 21606000 |
| Number of I/O | 468 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Présentation
Description
The Kintex UltraScale architecture offers a balance of high speed and low power consumption, achieved through advanced 20nm process technology. It features a large number of configurable logic blocks, DSP slices, and high-speed I/O pins, making it suitable for complex, computationally intensive tasks. Additional features include transceivers for high-bandwidth connectivity and support for various interfacing protocols. The XCKU040-2SFVA784E is often employed in scenarios requiring high throughput and flexibility, benefitting industries that demand robust and adaptable FPGA solutions.
Equivalent
1. Intel (Altera) Stratix 10 series.
2. Lattice ECP5 series.
3. Microsemi (Microchip) PolarFire series.
While these parts might offer similar performance characteristics, exact feature parity, such as I/O count, power consumption, or specific capabilities, will vary. Always refer to detailed datasheets and specifications for precise matching to application requirements.
Features
1. Logic Cells: It offers around 1.2 million system logic cells, which contribute to its high processing capabilities.
2. Performance: The device supports a range of high-performance I/Os and transceiver options, enabling rapid data transfer.
3. Memory Resources: It includes abundant memory resources such as block RAM and UltraRAM, enhancing data handling capabilities.
4. DSP Slices: It integrates numerous DSP slices for efficient signal processing tasks.
5. Power Efficiency: The device is optimized for low power consumption, making it suitable for energy-sensitive applications.
6. Scalability: Designed to support a broad range of applications, from communication to automotive, due to its scalable architecture.
7. Package: Comes in a 784-pin flip-chip BGA package, facilitating integration into various hardware systems.
These features make the XCKU040-2SFVA784E suitable for applications requiring a balance of performance, flexibility, and efficiency.
Pinout
The functions of the XCKU040 include significant logic resources, DSP slices, block RAM, and high-speed serial transceivers. It is suitable for applications such as data centers, video processing, wireless communication, and other areas requiring efficient processing capabilities. The device supports various I/O standards and interfaces, including DDR4/3 memory interfaces, PCIe, Ethernet, and more, due to its configurable I/O pins and integrated hard IP cores. This flexibility allows designers to tailor the FPGA for specific application needs, maximizing its utility across a wide range of applications.
Manufacturer
Xilinx's products are widely used for applications requiring high performance, adaptability, and energy efficiency. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), which is a major player in the semiconductor industry, further expanding its capabilities and market reach. Under AMD, Xilinx continues to innovate in the programmable logic sector, contributing to advancements in artificial intelligence, machine learning, and other cutting-edge technologies.