Images à titre indicatif uniquement
XC7K325T-2FFG676C
+NomenclatureIC FPGA 400 I/O 676FCBGA
-
FabricantAMD Xilinx
-
Pièce fabricant #XC7K325T-2FFG676C
-
Package BGA-676
-
En stock3428
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
Garantie produit authentique
Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 25475 |
| Number of Logic Elements/Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Présentation
Description
This device features 326,080 logic cells, making it suitable for complex digital designs. It also includes 840 DSP slices, which are useful for signal processing tasks, and up to 16.35 Mb of block RAM, providing ample on-chip memory for various applications. The FFG676 package denotes a fine-pitch BGA with 676 pins, facilitating higher I/O connectivity.
The XC7K325T is ideal for applications such as telecommunications, automotive, industrial, and video processing, where processing power and flexibility are crucial. It supports advanced design features like partial reconfiguration, which allows sections of the FPGA to be reprogrammed without disrupting operation, enhancing adaptability and functionality.
Equivalent
1. Altera (now Intel) Cyclone V or Arria V FPGAs, depending on specific requirements.
2. Lattice ECP5 series for cost-sensitive applications with similar logic density.
3. Microsemi (now Microchip) SmartFusion2 or IGLOO2 FPGAs for applications requiring low power or integrated ARM cores.
Each alternative should be evaluated based on specific application needs such as logic density, power consumption, and I/O requirements.
Features
1. Logic and Memory:
- Approximately 326,080 logic cells.
- 840 DSP slices for high-performance digital signal processing.
- 16,020 Kb of block RAM for data storage.
2. Performance:
- Optimized for high-performance applications with a speed grade of -2.
- Supports high-speed, low-power operations.
3. I/O and Connectivity:
- 400 user I/Os.
- High-speed SelectIO technology with support for numerous I/O standards.
- Supports multi-gigabit transceivers for fast data transmission.
4. Power Efficiency:
- Designed for power efficiency, suitable for applications where low power consumption is critical.
5. Packaging:
- Housed in an FFG676 package, which is a fine-pitch ball grid array (BGA) with 676 pins.
6. Applications:
- Ideally suited for applications in wireless communication, broadcasting, automotive, and high-performance computing.
This FPGA offers a balance of performance, power efficiency, and connectivity, making it suitable for a variety of demanding applications.
Pinout
The functions of the XC7K325T-2FFG676C include:
1. Logic Cells: It contains approximately 326,080 logic cells, useful for implementing complex digital circuits.
2. DSP Slices: The FPGA has 840 DSP slices, which are ideal for signal processing applications.
3. Block RAM: It includes 44536 Kbits of block RAM for data storage.
4. Transceivers: The FPGA is equipped with high-speed serial transceivers for data transmission.
5. I/O Pins: It supports numerous I/O standards for interfacing with other components.
6. Clocks: The FPGA has clock management resources for clock synthesis and management.
These features make the XC7K325T-2FFG676C suitable for applications in communications, automotive, industrial, and other sectors requiring robust digital signal processing and interfacing capabilities.
Manufacturer
Application
1. Telecommunications: Used in wireless base stations and broadband infrastructure for signal processing.
2. Data Centers: Assists in high-speed networking and data processing tasks.
3. Industrial Automation: Aids in real-time control and monitoring systems.
4. Aerospace and Defense: Utilized in radar systems and secure communications.
5. Broadcast and Video: Supports high-definition video processing and encoding.
6. Medical Imaging: Enhances imaging equipment with real-time data processing capabilities.
These applications leverage its high processing power, flexible architecture, and efficient performance.