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XC7A35T-2FGG484I
+NomenclatureIC FPGA 250 I/O 484FBGA
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FabricantAMD Xilinx
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Pièce fabricant #XC7A35T-2FGG484I
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Package BBGA-484
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En stock2079
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 2600 |
| Number of Logic Elements/Cells | 33280 |
| Total RAM Bits | 1843200 |
| Number of I/O | 250 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Présentation
Description
Key features of the XC7A35T-2FGG484I include:
1. Logic Cells: It offers approximately 33,280 logic cells, providing ample resources for complex designs.
2. I/O and Connectivity: With 285 I/O pins, it supports multiple I/O standards and configurations, facilitating a wide range of connectivity options.
3. Operating Conditions: The "-2" speed grade and industrial temperature range ("I") make it reliable in demanding environments.
4. Package: The FGG484 package is a fine-pitch ball grid array, enhancing space efficiency on printed circuit boards.
5. Power Efficiency: Built on 28nm process technology, it balances performance with power efficiency.
Overall, the XC7A35T-2FGG484I is an ideal choice for cost-sensitive applications that demand high performance without sacrificing power efficiency.
Equivalent
Features
1. Logic Cells: Approximately 33,280 logic cells.
2. DSP Slices: 90 DSP slices for efficient signal processing.
3. Block RAM: Around 1,800 Kb of block RAM.
4. I/O Pins: 250 user I/O pins, facilitating diverse interfacing options.
5. Package: Comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.
6. Voltage: Operates at a core voltage of 1.0V and supports I/O standards from 1.2V to 3.3V.
7. Temperature Range: Industrial temperature range, making it suitable for harsh environments.
8. Clock Management: Features multiple clock management tiles with PLLs for flexible clocking options.
9. Power: Low power consumption, ideal for energy-efficient applications.
This FPGA is well-suited for automotive, consumer electronics, and industrial applications, providing a balance of performance and cost-efficiency.
Pinout
1. General-Purpose I/O (GPIO): Used for interfacing with other components and devices.
2. Power Supply Pins: Provide the necessary power to the FPGA.
3. Configuration Pins: Used for configuring the FPGA at startup.
4. Dedicated Clock Inputs: For clock signal inputs.
5. JTAG Interface: Used for programming and debugging.
6. Multi-Gigabit Transceivers (MGTs): Used for high-speed serial communications.
These pins are designed to support a wide range of applications, providing flexibility for implementing custom digital logic. The XC7A35T-2FGG484I is suited for applications requiring a balance of performance, cost, and power efficiency, such as in consumer electronics, communications, and other embedded systems.
Manufacturer
Xilinx was founded in 1984 and is recognized as a leader in the FPGA industry. In 2020, Advanced Micro Devices (AMD), a multinational semiconductor company, announced it would acquire Xilinx, and the acquisition was completed in February 2022. This acquisition has enabled AMD to expand its portfolio and capabilities in the data center, embedded, and high-performance computing markets.
Application
1. Communications: Network infrastructure, wireless communication systems, and data transmission.
2. Industrial: Automation systems, motor control, and monitoring equipment.
3. Consumer Electronics: Video processing and display technologies.
4. Medical Devices: Diagnostic and imaging equipment.
5. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
6. Aerospace and Defense: Radar and signal processing.
Its flexibility and efficiency make it suitable for a wide range of devices needing custom digital logic solutions.