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XC7A200T-L2FBG676E
+NomenclatureIC FPGA 400 I/O 676FCBGA
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FabricantAMD Xilinx
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Pièce fabricant #XC7A200T-L2FBG676E
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Package FCBGA-676
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En stock5355
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 16825 |
| Number of Logic Elements/Cells | 215360 |
| Total RAM Bits | 13455360 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Présentation
Description
Key features of the XC7A200T-L2FBG676E include around 215,360 logic cells, 740 DSP slices for intensive arithmetic operations, and approximately 13.14 Mb of block RAM for data storage. It offers a balanced mix of performance and power, making it suitable for medium to high-end applications. The FPGA is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package, which is compact and supports complex designs.
It supports various I/O standards and protocols, making it versatile for different application requirements. Additionally, it comes with Xilinx's Vivado Design Suite software support, which facilitates efficient design and implementation processes.
Equivalent
Features
1. Logic Cells: Contains approximately 215,360 logic cells, suitable for complex designs.
2. DSP Slices: Offers 740 DSP slices for efficient digital signal processing tasks.
3. Memory: Provides 13,140 Kbits of block RAM, enabling high-speed data storage and retrieval.
4. I/O Pins: Equipped with 400 I/O pins for versatile connectivity options.
5. Performance: Designed with low power consumption while achieving high performance, ideal for battery-powered applications.
6. Package: Comes in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package.
7. Speed Grade: L2 speed grade, indicating specific performance characteristics in terms of timing and data processing capabilities.
These features make the XC7A200T-L2FBG676E suitable for applications in areas such as wireless communication, high-speed data processing, and embedded systems.
Pinout
Key functions of the XC7A200T include:
1. Logic Cells: It contains around 215,360 logic cells, supporting complex digital designs.
2. I/O Pins: It provides a wide range of general-purpose I/O pins for interfacing with external components.
3. Memory: It is equipped with block RAM and distributed RAM for flexible memory architectures.
4. DSP Slices: The FPGA has DSP slices for efficient arithmetic operations.
5. Clock Management: It includes clock management tiles for robust clocking solutions.
6. Connectivity: Offers various interfaces, including PCIe, Ethernet, and more, depending on configuration.
This FPGA is suitable for cost-sensitive applications that require high performance with a focus on power efficiency.
Manufacturer
Founded in 1984 and headquartered in San Jose, California, Xilinx is known for pioneering the fabless manufacturing model in the semiconductor industry. This means that while they design and market their products, the actual manufacturing is outsourced to third-party semiconductor fabrication plants.
Xilinx's products are widely used across various industries, including telecommunications, automotive, aerospace, defense, and consumer electronics. In 2020, the company was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry, which designs and produces microprocessors and graphics processing units (GPUs). Despite the acquisition, Xilinx continues to operate as a subsidiary under the AMD umbrella, maintaining its focus on producing programmable logic devices and solutions.
Application
1. Communications: Implements high-speed data links and signal processing.
2. Automotive: Supports advanced driver assistance systems (ADAS) and in-car infotainment.
3. Industrial: Enables motor control, machine vision, and industrial networking.
4. Consumer Electronics: Powers high-definition displays and smart home devices.
5. Medical Devices: Facilitates imaging and diagnostic equipment.
6. Aerospace and Defense: Used in radar systems and secure communications.
Its versatility makes it suitable for applications requiring high performance and flexibility.