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XC3S700A-4FTG256I
+NomenclatureIC FPGA 161 I/O 256FTBGA
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FabricantAMD
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Pièce fabricant #XC3S700A-4FTG256I
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En stock2625
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Spécifications
| Attribut | Valeur |
| Series | Spartan®-3A |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of I/O | 161 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC3S700 |
| Number of LA Bs / CL Bs | 1472 |
| Number of Gates | 700000 |
Présentation
Description
Key specifications include:
- Architecture: Based on a 90nm process technology, offering a balance of performance and power efficiency.
- Logic Cells: Contains 3,840 logic cells with a combination of lookup tables (LUTs) and flip-flops.
- I/O Ports: Supports up to 156 I/O pins with various voltage standards.
- Memory: Includes 56 kilobits of block RAM for data storage and buffering.
- Configuration: Can be configured via JTAG or flash memory, supporting multiple design implementations.
The XC3S700A is ideal for prototyping and developing complex digital systems, providing flexibility and scalability for engineers and designers.
Equivalent
Features
- Configuration: 700,000 system gates, offering significant logic capacity for various applications.
- I/O Pins: 256-ball fine-pitch ball grid array (BGA) package with up to 232 user I/O pins.
- Performance: Operates at a maximum clock frequency of 200 MHz, suitable for high-speed applications.
- Memory: Supports up to 88 Kbits of embedded block RAM and 4 Kbits of distributed RAM.
- DSP Blocks: Contains dedicated DSP slices for efficient signal processing tasks.
- Power Consumption: Low power operation, making it ideal for battery-powered devices.
- Configuration Options: Supports various configuration modes, including JTAG and SPI.
- Development Tools: Compatible with Xilinx design tools like ISE and Vivado for easy design implementation.
These features make the XC3S700A-4FTG256I suitable for a wide range of applications, including communications, automotive, and industrial control systems.
Pinout
The primary functions of the XC3S700A include digital signal processing, complex logic implementation, and interfacing with various peripherals and communication protocols. It supports multiple I/O standards, has configurable logic blocks, and features dedicated hardware for tasks like multiplier and distributed RAM. The FPGA is designed for applications in consumer electronics, automotive, telecommunications, and other industries that require customizable logic solutions.
Overall, the XC3S700A-4FTG256I provides a versatile platform for implementing a wide range of digital designs efficiently.
Manufacturer
Xilinx is known for its innovation in the field of reconfigurable computing, enabling engineers to create custom hardware solutions tailored to specific applications. The company serves various industries, including telecommunications, automotive, aerospace, defense, industrial automation, and consumer electronics. Xilinx's products are widely utilized in applications ranging from signal processing and data processing to high-performance computing and artificial intelligence.
In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and expanding its reach in the semiconductor market. The XC3S700A-4FTG256I is part of the Spartan-3A series, which is designed for low-cost, high-performance applications.
Application
1. Embedded Systems: For custom hardware acceleration and processing.
2. Telecommunications: Used in signal processing and protocol implementation.
3. Industrial Automation: For control systems and machinery interfacing.
4. Consumer Electronics: In devices requiring hardware customization.
5. Automotive: For advanced driver-assistance systems (ADAS) and infotainment systems.
6. Aerospace and Defense: In avionics and military communication systems.
This FPGA supports various logic-intensive applications due to its flexibility and programmable architecture.