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XC3S50A-4FTG256C
+NomenclatureIC FPGA 144 I/O 256FTBGA
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FabricantAMD Xilinx
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Pièce fabricant #XC3S50A-4FTG256C
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Package FBGA-256
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En stock6077
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Spartan®-3A |
| Part Status | Active |
| Number of LABs/CLBs | 176 |
| Number of Logic Elements/Cells | 1584 |
| Total RAM Bits | 55296 |
| Number of I/O | 144 |
| Number of Gates | 50000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Présentation
Description
The device operates with a core voltage of 1.2V and supports multiple package options, with the FTG256 package being a fine-pitch ball grid array (BGA) that offers a compact footprint. The "-4" refers to the speed grade, indicating its performance characteristics. The Spartan-3A series also includes features like block RAM, DCMs for clock management, and support for digital signal processing.
The XC3S50A-4FTG256C is a versatile FPGA suitable for rapid prototyping and production, offering a low-cost solution for high-volume applications.
Equivalent
1. Altera (now Intel) Cyclone II EP2C5 series.
2. Lattice Semiconductor MachXO2 series, such as the LCMXO2-4000HC.
3. Microsemi (now Microchip) IGLOO or ProASIC3 series.
These products offer similar functionality in terms of logic elements and I/O capabilities but may differ in architecture and specific features. Always ensure compatibility and fit for your specific application requirements.
Features
1. Logic Cells: Approximately 50,000 system gates.
2. Configurable Logic Blocks (CLBs): Contains a limited number of CLBs for implementing logic functions.
3. I/O Pins: 195 user I/O pins, supporting various I/O standards.
4. Package: Available in a 256-ball Fine-Pitch Thin Grid Array (FTG256) package.
5. Performance: -4 speed grade indicating moderate performance.
6. Memory: Includes Block RAM and Distributed RAM for flexible storage solutions.
7. Clock Management: Features Digital Clock Managers (DCMs) for phase shifting and clock distribution.
8. Power: Designed for low power consumption in embedded applications.
9. Compatibility: Supports various I/O standards such as LVTTL, LVCMOS, PCI, and more.
10. Tools Support: Compatible with Xilinx ISE Design Suite for development.
These features make it suitable for applications requiring a balance of performance, cost, and flexibility.
Pinout
Key features and functions include:
- Logic Cells: The XC3S50A has a total of 1,728 logic cells, enabling the implementation of complex logic functions.
- I/O Pins: It supports up to 195 user I/Os, providing flexibility for interfacing with other components.
- RAM: The device includes 54 Kbits of distributed RAM for data storage and processing tasks.
- Dedicated Multiplier Blocks: It offers 3 dedicated multipliers, which is beneficial for DSP applications.
- Clock Management: It features Digital Clock Managers (DCMs) for clock signal management and synthesis.
This combination of features makes the XC3S50A-4FTG256C suitable for a variety of digital circuit applications, focusing on efficiency and adaptability.