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XC3S400A-4FTG256I
+NomenclatureIC FPGA 195 I/O 256FTBGA
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FabricantAMD Xilinx
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Pièce fabricant #XC3S400A-4FTG256I
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Package FBGA-256
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En stock1829
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 896 |
| NumberofLogicElements/Cells | 8064 |
| TotalRAMBits | 368640 |
| NumberofI/O | 195 |
| NumberofGates | 400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Présentation
Description
Key features include:
1. Configurable Logic Blocks (CLBs): These provide the basic logic functionality.
2. I/O Blocks: Support various I/O standards, enabling connectivity with different voltage levels and logic families.
3. Embedded Memory: Includes Block RAM for efficient data storage and retrieval.
4. Multipliers and DSP capabilities: Useful for digital signal processing tasks.
5. Low Power and Cost-Effective: Optimized for low power consumption, which is crucial for battery-operated devices and cost-sensitive applications.
The "-4" denotes the speed grade, with higher numbers generally indicating faster performance. "FTG256" refers to the package type and pin count, and "I" indicates an industrial temperature range, suitable for demanding environmental conditions in industrial applications.
Overall, the XC3S400A-4FTG256I is ideal for a variety of applications, including communications, consumer electronics, and industrial automation.
Equivalent
Features
1. Logic Cells: It contains approximately 400,000 system gates with 8,064 logic cells.
2. Configurable Logic Blocks (CLBs): These include four slices each, providing the flexibility to implement a wide range of logic functions.
3. I/O Pins: Offers up to 195 user I/O pins for versatile interfacing options.
4. Memory: Includes 360 Kbits of block RAM for enhanced data storage and processing.
5. DSP Slices: Provides dedicated resources for digital signal processing tasks.
6. Clock Management: Features four Digital Clock Managers (DCMs) for precise clock distribution and management.
7. Package: Comes in a 256-ball Fine-Pitch Thin Ball Grid Array (FTG256) package.
8. Temperature Range: Industrial-grade with an operating temperature range from -40°C to +100°C.
9. Speed Grade: "-4" indicating a specific performance level.
This FPGA is suitable for applications requiring moderate complexity and high integration capability.
Pinout
The primary functions and features include:
1. Logic Resources: It provides approximately 400,000 system gates and 8,064 logic cells, suitable for moderate complexity digital logic designs.
2. Memory Blocks: It includes distributed RAM and block RAMs for efficient data storage and retrieval.
3. I/O Pins: The device supports multiple I/O standards with a configurable number of I/O pins, optimizing connectivity.
4. Clock Management: Integrated Digital Clock Managers (DCMs) are available for clock signal manipulation and optimization.
5. Configuration Options: It supports various configuration modes including Master Serial, Slave Serial, and Boundary-Scan (JTAG).
6. Power Management: Spartan-3A devices are designed to be power-efficient, catering to applications requiring low power consumption.
Overall, the XC3S400A-4FTG256I is versatile for applications in consumer electronics, communications, and industrial automation.
Manufacturer
Application
1. Consumer Electronics: Used in devices requiring custom logic, interfacing, or signal processing.
2. Automotive Systems: Suitable for infotainment, driver assistance systems, and control units.
3. Industrial Automation: Implementing control systems, communication interfaces, and signal processing.
4. Telecommunications: Used in data processing, protocol translation, and network interfacing.
5. Medical Devices: Employed in imaging equipment and diagnostic tools for data acquisition and processing.
6. Networking: Supports applications in routers and switches for traffic management.
These applications leverage the FPGA's reprogrammable nature and efficient performance in handling complex tasks.