Images à titre indicatif uniquement
XC3S200-4FTG256I
+NomenclatureIC FPGA 173 I/O 256FTBGA
-
FabricantAMD Xilinx
-
Pièce fabricant #XC3S200-4FTG256I
-
Package BGA-256
-
En stock5375
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
Garantie produit authentique
Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 480 |
| Number of Logic Elements/Cells | 4320 |
| Total RAM Bits | 221184 |
| Number of I/O | 173 |
| Number of Gates | 200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Présentation
Description
The "-4" indicates the speed grade, with this particular model offering moderate performance in its class. The "I" at the end of the part number denotes its industrial-grade temperature range, suitable for applications operating in more demanding environmental conditions. The XC3S200 supports various I/O standards and has multiple dedicated multipliers and block RAMs, enhancing its capability for digital signal processing and data storage tasks.
Ideal for prototyping and small-scale production, the XC3S200-4FTG256I is used in industries ranging from consumer electronics to automotive. It offers a cost-effective solution for designers needing customizable logic without the expense of higher-end FPGAs.
Equivalent
Features
1. Logic Cells: It contains 200,000 system gates.
2. Package: Comes in a Fine-Pitch Ball Grid Array (FTBGA) with 256 pins.
3. Speed Grade: The "-4" denotes its speed grade, indicating moderate performance and power characteristics.
4. I/O Pins: Offers extensive connectivity with a significant number of I/O pins.
5. Temperature Range: The "I" in its name signifies an industrial-grade part, meaning it can operate in temperatures typically ranging from -40°C to 100°C.
6. RAM Blocks: Incorporates distributed RAM and block RAM for versatile memory implementation.
7. Dedicated Multipliers: Features built-in multipliers for efficient signal processing.
8. JTAG Support: Facilitates easy configuration and testing through JTAG.
9. Clock Management: Includes Digital Clock Managers (DCMs) for advanced clock management.
This FPGA is well-suited for cost-sensitive applications that require reliable performance across various environmental conditions.
Pinout
Key functions and features of the XC3S200-4FTG256I include:
1. Logic Cells: It has 4320 logic cells, which are used for implementing digital circuits.
2. I/O Pins: It supports numerous I/O standards with up to 173 user I/O pins available, depending on the configuration.
3. Block RAM: It includes 216 Kbits of block RAM for data storage.
4. DCMs: It has 4 Digital Clock Managers (DCMs) for clock management tasks like clock distribution and phase shifting.
5. Speed Grade: The "-4" in the part number indicates the speed grade, which affects the timing and performance characteristics.
6. Temperature Range: The "I" at the end denotes an industrial temperature range, suitable for more demanding environments.
This FPGA is suitable for a variety of applications, including communications, consumer electronics, automotive, and industrial systems.
Manufacturer
Application
1. Consumer Electronics: Used in products requiring customization and flexibility, such as HDTVs and digital cameras.
2. Industrial Automation: Employed in control systems, robotics, and machinery for automation tasks.
3. Communications: Utilized in networking equipment for data processing and signal handling.
4. Automotive Systems: Integrated into advanced driver assistance systems (ADAS) and infotainment systems.
5. Medical Devices: Applied in imaging equipment and diagnostic tools for signal processing tasks.
6. Aerospace and Defense: Used in avionics and defense systems for reliable, high-speed processing.
Its versatility makes it suitable for prototyping and production systems across diverse industries.