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XC3S1400A-4FTG256I
+NomenclatureIC FPGA 161 I/O 256FTBGA
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FabricantAMD Xilinx
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Pièce fabricant #XC3S1400A-4FTG256I
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Package BGA-256
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En stock2820
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2816 |
| NumberofLogicElements/Cells | 25344 |
| TotalRAMBits | 589824 |
| NumberofI/O | 161 |
| NumberofGates | 1400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Présentation
Description
- Logic Cells: 1.4 million (equivalent to ~25K logic gates).
- Speed Grade: -4 (moderate performance).
- Package: 256-pin Fine-Pitch Ball Grid Array (FTG256).
- I/O Pins: 195 user I/Os supporting multiple standards (LVCMOS, LVTTL, etc.).
- On-Chip Memory: 576 Kb block RAM.
- DSP Slices: 32 (for arithmetic functions).
- Clock Management: Digital Clock Manager (DCM) for phase shifting & frequency synthesis.
Applications: Embedded systems, industrial control, communications, and consumer electronics.
Advantages: Low power, high I/O-to-logic ratio, and non-volatile configuration options (via SPI flash).
For detailed specs, refer to Xilinx DS529 (Spartan-3A datasheet).
Equivalent
1. Spartan-3E series (e.g., XC3S1200E-4FTG256C) – similar logic capacity but different features.
2. Spartan-6 series (e.g., XC6SLX16-2FTG256C) – newer, more efficient, but may require migration.
3. Lattice ECP3 (e.g., LFE3-70EA-8FN256C) – competitive FPGA from another vendor.
Check pin compatibility and features before substitution.
Pinout
- Pin Count: 256 (FTG256 package, Fine-Pitch Ball Grid Array).
- Logic Cells: ~1.4 million system gates.
- I/O Pins: 195 user I/Os (supports LVCMOS, LVTTL, HSTL, and SSTL standards).
- Function: Configurable logic for digital designs, featuring block RAM (576 Kb), DSP slices, and clock management (DCM).
- Speed Grade: -4 (moderate performance).
- Operating Temp: Industrial (-40°C to +100°C).
Suited for embedded, industrial, and consumer applications.
Application
- Embedded Systems (control, automation)
- Communication (networking, signal processing)
- Industrial Electronics (motor control, sensors)
- Consumer Electronics (displays, multimedia)
- Medical Devices (portable diagnostics)
- Military/Aerospace (rugged, low-power applications)
Its low cost, moderate logic density (1.4M gates), and 256-pin BGA package make it suitable for cost-sensitive, mid-complexity designs.