XC3S1400A-4FGG676C

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XC3S1400A-4FGG676C

+Nomenclature

IC FPGA 502 I/O 676FBGA

  • FabricantAMD Xilinx

  • Pièce fabricant #XC3S1400A-4FGG676C

  • Package BGA-676

  • En stock6791

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Spécifications

Attribut Valeur
Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 2816
NumberofLogicElements/Cells 25344
TotalRAMBits 589824
NumberofI/O 502
NumberofGates 1400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Présentation

Description

The XC3S1400A-4FGG676C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A family, designed for cost-sensitive applications. It features a high logic density with approximately 1.4 million system gates and is housed in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. The "-4" in the part number indicates the speed grade, with lower numbers representing faster performance. Key features include abundant I/O options, efficient power management, and support for various I/O standards, making it versatile for diverse applications such as communications, consumer electronics, and automotive systems. The Spartan-3A series emphasizes reducing system costs while maintaining performance, making it suitable for both prototyping and production. The FPGA is also equipped with embedded multipliers and block RAMs, enhancing its ability to handle complex computations and data storage efficiently. Overall, the XC3S1400A-4FGG676C is valued for its balance of performance, flexibility, and cost-effectiveness in FPGA-based designs.

Equivalent

The XC3S1400A-4FGG676C is a Xilinx Spartan-3A FPGA. Equivalent products could include other FPGAs with similar logic capacity and performance characteristics, such as the Lattice ECP3 series or the Intel (formerly Altera) Cyclone III series. When considering an equivalent, factors like the number of logic cells, I/O pins, power consumption, and package type should be compared. Specific models will vary based on the application's specific requirements and constraints.

Features

The XC3S1400A-4FGG676C is a part of Xilinx's Spartan-3A family of FPGAs. Key features include:
1. Logic Gates: Approximately 1.4 million system gates.
2. Logic Cells: 20,480.
3. Configurable Logic Blocks (CLBs): Composed of slices, each with Look-Up Tables (LUTs).
4. I/O Blocks: Supports various standards with 391 I/O pins, offering flexibility in interfacing.
5. Embedded RAM: 720 Kbits of block RAM, providing efficient data handling.
6. Clock Management: Features Digital Clock Managers (DCMs) for advanced clocking capabilities.
7. Speed Grade: Designated as -4, indicating a specific speed performance.
8. Package: FGG676, a fine-pitch ball grid array package.
9. Voltage: Operates at a core voltage of 1.2V.
10. Advanced Design: Built on a 90nm process technology for efficient power usage.
11. Application: Suitable for cost-sensitive, high-volume applications including consumer electronics and automotive.
These features make it a versatile choice for various applications requiring moderate to high system complexity with cost efficiency.

Pinout

The XC3S1400A-4FGG676C is a member of the Xilinx Spartan-3A FPGA family. It is housed in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. This FPGA is designed for a variety of applications, including consumer electronics, industrial automation, and other areas requiring high-performance programmable logic.
The key features and functions of the XC3S1400A include:
- Logic Cells: It contains 1,419,904 system gates and 23,040 logic cells, making it suitable for medium-complexity designs.
- I/O Pins: The device offers a flexible I/O pin configuration, with the actual number of usable I/Os dependent on the specific design and configuration.
- Block RAM: It includes 58,752 bits of block RAM for data storage.
- Clock Management: The FPGA supports digital clock managers (DCMs) to manage clock distribution and phase alignment.
- Configuration Options: It can be configured using various methods, including JTAG and serial or parallel PROM.
These features make the XC3S1400A a versatile choice for implementing a wide range of digital logic designs.

Manufacturer

The XC3S1400A-4FGG676C is manufactured by Xilinx, Inc. Xilinx is a technology company known for designing and developing programmable logic devices such as field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). These products are widely used in various industries, including telecommunications, automotive, aerospace, defense, and consumer electronics. Xilinx is a pioneer in the field of FPGAs, providing solutions that allow for hardware customization and flexibility, enabling companies to optimize performance and reduce time to market. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company that develops computer processors and related technologies for various applications.

Application

The XC3S1400A-4FGG676C is a Spartan-3 FPGA from Xilinx, designed for various applications due to its versatility, cost-effectiveness, and moderate logic density. Key application areas include:
1. Consumer Electronics: Used in HDTVs, set-top boxes, and digital radios for signal processing and interfacing tasks.
2. Industrial Automation: Facilitates control systems, motor controllers, and data acquisition devices.
3. Communications: Supports networking equipment like routers and switches through data routing and protocol handling.
4. Automotive Systems: Supports infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Used in imaging systems and diagnostic equipment for custom processing.
6. Aerospace and Defense: Used in navigation systems and secure communications.
These applications leverage the FPGA's reprogrammability, low power consumption, and efficient performance.

Package

The XC3S1400A-4FGG676C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A family. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. This FPGA is suitable for various applications, providing a balance of performance, low cost, and flexibility in digital circuit design.

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