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XC3S1400A-4FGG484I
+NomenclatureIC FPGA 375 I/O 484FBGA
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FabricantAMD Xilinx
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Pièce fabricant #XC3S1400A-4FGG484I
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Package BGA-484
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En stock6565
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2816 |
| NumberofLogicElements/Cells | 25344 |
| TotalRAMBits | 589824 |
| NumberofI/O | 375 |
| NumberofGates | 1400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BBGA |
Présentation
Description
Key features include 20,160 logic cells and a variety of I/O standards support, making it versatile for various interface requirements. It has an enhanced support for digital signal processing, embedded memory, and clock management, ensuring efficient processing and integration within systems. The "I" in the part number signifies that it is rated for industrial temperature ranges, suitable for applications in more demanding environmental conditions.
Ideal applications include consumer electronics, industrial control systems, communications, and automotive sectors. The XC3S1400A-4FGG484I combines a competitive mix of logic resources, power efficiency, and cost-effectiveness, making it a popular choice for designers aiming to optimize performance and budget.
Equivalent
1. Altera Cyclone II series (e.g., EP2C8)
2. LatticeECP2 series
3. Microsemi (Actel) IGLOO series
These alternatives may not be direct drop-in replacements and might require design adjustments due to differences in architecture, pin configuration, and other specifications. Always verify compatibility with your specific application requirements.
Features
1. Logic Resources: Contains 1,419,264 system gates and 23,552 logic cells, enabling complex digital designs.
2. I/O and Package: Offers 372 user I/Os and comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.
3. Performance: Speed grade of -4, suitable for mid-range performance needs.
4. Memory: Includes 588 Kbits of block RAM for data storage.
5. DSP Slices: Features dedicated hardware multipliers to support digital signal processing tasks.
6. Power: Designed with low power consumption in mind, making it suitable for battery-powered devices.
7. Temperature Range: Industrial-rated with an operational temperature range suitable for harsh environments.
8. Configuration: Supports multiple configuration options, including JTAG and serial modes.
This FPGA is ideal for a wide range of embedded applications, including industrial, automotive, and communications systems.
Pinout
Key functions of the XC3S1400A include:
1. Logic Cells: It has a significant number of configurable logic blocks (CLBs) that can be programmed to perform a variety of logic functions.
2. I/O Options: Offers numerous I/O pins that support various I/O standards for interfacing with other components and systems.
3. Memory: Includes embedded block RAM for data storage and processing.
4. Clock Management: Features Digital Clock Managers (DCMs) for clock signal generation and management.
5. Configurable Features: Allows for configuration via multiple methods, including JTAG and serial or parallel modes.
This FPGA is suitable for moderate complexity tasks where flexibility and reprogrammability are important.