XC2VP70-6FF1704I

XC2VP70-6FF1704I is a Xilinx Virtex-II Pro FPGA (model XC2VP70) with about 70k logic cells, speed grade -6, in a FF1704I flip-chip BGA package (1704 balls) and industrial temperature range (I). The Virtex-II Pro family combines programmable logic fabric with a hard PowerPC 405 processor core option for embedded processing, plus Block RAM, DSP resources, and many I/O banks for high-density designs. It’s suited for high-performance embedded systems, telecom, data processing, and test equipment where reconfigurable hardware and an integrated processor are beneficial. Design flow uses Xilinx ISE (and PlanAhead) to synthesize, implement, and generate bitstreams. For exact resource counts (BRAM, DSP slices), transceiver capabilities, and PPC options, consult the official Xilinx data sheet and user guide for XC2VP70-6FF1704I.

Key features of XC2VP70-6FF1704I:
- Virtex-II Pro device with ~70K logic cells
- Embedded PowerPC 405 hard processor core
- 2.5V core voltage; 3.3V I/O banks
- On-chip RAM blocks and DSP slices for signal processing
- Multiple PLLs and advanced clock management
- High-density Flip-Chip BGA package: FF1704 (1704 balls)
- Speed grade -6
- Industrial temperature range (-40°C to +85°C)
Ideal for embedded processing, high-performance control, and mixed-signal applications.

- Pin count: 1704 pins (FF1704 package)
- Function: Xilinx Virtex-2 Pro FPGA (XC2VP70-6); a 70K-logic-cell reconfigurable FPGA in an FF1704 BGA, with an integrated PowerPC 405 hard processor core (embedded processing option).

- Manufacturer: Xilinx (now part of AMD).
- What kind of company: A semiconductor company that designs and manufactures programmable logic devices (FPGAs, CPLDs, programmable SoCs) and the associated design software/IP.

Applications areas for XC2VP70-6FF1704I include:
- Embedded processing with on-chip PowerPC 405 for real-time software/hardware co-design
- High-throughput DSP and signal processing (audio, video, imaging, communications)
- Communications systems (baseband/PHY, packet processing, SDR)
- RF/wireless front-end support (mod/demod, DAC/ADC interfaces)
- Aerospace/defense (radar/sonar processing, EW, secure communications)
- Medical instrumentation and imaging systems
- Data acquisition, test & measurement, and rapid prototyping of accelerators
These reflect its FPGA fabric plus embedded processing capabilities for diverse, performance-critical tasks.

FF1704 Flip-Chip Ball Grid Array (FBGA) package, 1704 balls, Industrial temperature grade.