TSS521DR

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TSS521DR

+Nomenclature

IC TRANSCEIVER HALF 1/1 16SOIC

  • FabricantTexas Instruments

  • Pièce fabricant #TSS521DR

  • En stock2436

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Spécifications

Attribut Valeur
Part Status Active
Type Transceiver
Protocol Meter Bus
Number of Drivers/Receivers 1/1
Duplex Half
Voltage - Supply 3.3V
Operating Temperature -25°C ~ 85°C
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package 16-SOIC
Base Product Number TSS521

Présentation

Description

The TSS521DR is a part of the Texas Instruments LIN transceiver series. Specifically designed for automotive applications, it facilitates communication in Local Interconnect Network (LIN) systems, which are used for connecting various sensors and actuators in vehicles. The transceiver acts as an interface between the LIN protocol controller and the physical bus line.
Key features of the TSS521DR include high electromagnetic compatibility, low power consumption, and enhanced protection against voltage transients, making it ideal for automotive environments. It supports data rates up to 20 kbps and features thermal shutdown protection and undervoltage detection to ensure reliable operation. The TSS521DR is also designed to minimize electromagnetic emissions and is compliant with LIN standards.
The device is housed in a small SOIC-8 package, which is suitable for space-constrained applications. With its robust performance and compliance with automotive standards, the TSS521DR is widely used in automotive systems that require reliable and efficient LIN communication.

Equivalent

The TSS521DR is a Serial Communication Interface (SCI) IC used for specific applications requiring LIN (Local Interconnect Network) protocol. Equivalent products or alternatives could include other LIN transceivers or similar communication interface ICs, such as the MCP2003 from Microchip Technology, the SN65HVDA100 from Texas Instruments, or the NCV7321 from ON Semiconductor. Compatibility will depend on specific application requirements, including voltage levels, data rates, and package types. Always consult the datasheets for precise compatibility.

Features

The TSS521DR is a LIN (Local Interconnect Network) transceiver designed for automotive and industrial applications, where robust and reliable serial communication is essential. Key features of the TSS521DR include:
1. LIN 2.0/2.1/2.2A Compliant: Supports industry-standard LIN protocols, ensuring compatibility and interoperability with other LIN devices.
2. Wide Supply Voltage Range: Operates over a broad voltage range, typically from 7V to 18V, making it suitable for various automotive and industrial environments.
3. Low Power Consumption: Features a sleep mode to minimize power usage when the LIN bus is idle.
4. Enhanced EMC Performance: Designed to offer excellent electromagnetic compatibility, reducing interference with other electronic systems.
5. Overtemperature Protection: Includes built-in thermal shutdown to protect the device from overheating.
6. Short-Circuit Protection: Safeguards against short circuits on the LIN bus.
7. Wake-Up Functionality: Capable of waking up the system from sleep mode via a LIN bus message.
8. Compact Package: Available in a small SOIC package, facilitating easy integration into various designs.
These features make the TSS521DR a reliable choice for LIN communication in demanding applications.

Pinout

The TSS521DR is a communication controller IC designed for power line communication applications. It is packaged in a 16-pin SOIC (Small Outline Integrated Circuit) package.
Here is a brief overview of its pin functions:
1. VCC: Positive supply voltage.
2. GND: Ground reference.
3. TXD: Transmit data input.
4. RXD: Receive data output.
5. TXEN: Transmit enable control.
6. RXEN: Receive enable control.
7. RESET: Reset input to initialize the device.
8. CLKIN: External clock input.
9. CLKOUT: Clock output for synchronization.
10. MODE: Mode selection for various operation configurations.
11. CAP: Connection pin for external capacitor (usually for timing adjustments).
12-14. NC: No internal connection, often used for mechanical stability.
15. TEST: Test pin for factory or development use.
16. IO: General-purpose I/O for custom functions.
These pins enable the TSS521DR to manage data transmission and reception over power lines, making it suitable for smart grid, home automation, and industrial communication applications.

Manufacturer

The TSS521DR is a product manufactured by Texas Instruments Incorporated, commonly referred to as TI. Texas Instruments is a global semiconductor company headquartered in Dallas, Texas. It designs and manufactures a wide range of semiconductor products including integrated circuits (ICs), microcontrollers, and embedded processors, which are used in electronic devices and systems. TI serves various industries such as automotive, industrial, personal electronics, communications equipment, and enterprise systems. It is known for its innovative products and solutions in the fields of analog technology, embedded processing, and digital signal processing.

Application

The TSS521DR is a remote temperature sensor IC commonly used in various applications for precise temperature monitoring and control. Key application areas include:
1. Consumer Electronics: Monitoring and managing the temperature in devices like laptops, gaming consoles, and smartphones.
2. Industrial Equipment: Ensuring optimal operation of machinery by tracking temperature changes.
3. HVAC Systems: Providing accurate temperature readings for effective heating, ventilation, and air conditioning control.
4. Automotive: Monitoring engine and battery temperatures to prevent overheating.
5. Data Centers: Maintaining the thermal management of servers and storage systems.
6. Medical Equipment: Ensuring precise temperature conditions in devices such as incubators or imaging equipment.

Package

The TSS521DR is a digital temperature sensor from Texas Instruments. It is housed in an 8-pin SOIC (Small Outline Integrated Circuit) package, commonly abbreviated as "SO" or "SOP" package. This package type is suitable for surface-mount technology, providing a compact and reliable form for electronic circuit integration.