TNY277GN

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TNY277GN

+Nomenclature

IC OFFLINE SWITCH FLYBACK 8SMD

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Spécifications

Attribut Valeur
Package Tube
Series TinySwitch®-III
ProductStatus Discontinued at Digi-Key
OutputIsolation Isolated
InternalSwitch(s) Yes
Voltage-Breakdown 700V
Topology Flyback
DutyCycle 65%
Frequency-Switching 132kHz
Power(Watts) 23.5 W
FaultProtection Current Limiting, Open Loop, Over Temperature, Over Voltage, Short Circuit
ControlFeatures EN
OperatingTemperature -40°C ~ 150°C (TJ)
Package/Case 8-SMD (7 Leads), Gull Wing
SupplierDevicePackage SMD-8C

Présentation

Description

TNY277GN is part of the TinySwitch-II family, a series of integrated circuits designed for use in power supply applications. These ICs are manufactured by Power Integrations and are known for their high efficiency and compact design, making them suitable for low power applications such as chargers, adapters, and standby power supplies.
Key features of the TNY277GN include its integrated 700V power MOSFET, oscillator, high voltage switching, and control circuitry. It supports design simplicity by eliminating the need for an optocoupler and secondary feedback circuitry. The device offers excellent efficiency even at low loads and meets international energy efficiency standards.
Its built-in current limit and thermal shutdown features provide enhanced reliability, while the auto-restart feature protects the power supply from overloads or short circuits. The TNY277GN operates over a wide input voltage range, which makes it adaptable for global applications. It is available in a surface-mount package, which helps in reducing the overall size of the power supply design. Overall, TNY277GN is valued for its ease of use, robust performance, and ability to reduce system cost.

Equivalent

The TNY277GN chip is a switch-mode power supply IC from Power Integrations, often used in low-power applications. Equivalent products include:
1. TNY278PN/GN - Higher power rating variant from the same series.
2. LNK304PN/GN - Similar from Power Integrations but different series.
3. VIPer12A - STMicroelectronics equivalent with similar functions.
4. TOPSwitch-HX series - Higher performance alternatives from Power Integrations.
5. NCP1027 - On Semiconductor's equivalent for similar applications.
Always check specifications to ensure compatibility.

Features

The TNY277GN is a part of the TinySwitch-III series from Power Integrations, designed for energy-efficient and cost-effective power supply solutions. Key features include:
1. Integrated Controller and MOSFET: This combination simplifies design and reduces component count.
2. Energy Efficiency: Offers low standby power consumption and high efficiency across load conditions.
3. Auto-Restart Protection: Provides protection against output short circuit and overload conditions.
4. Current Limit and Thermal Shutdown: Enhances device reliability by preventing damage from overcurrent and overheating.
5. Adjustable Current Limit: Allows for the adjustment of the current limit to optimize the design for various applications.
6. EcoSmart Technology: Minimizes energy consumption during no-load and light-load conditions.
7. Wide Input Voltage Range: Supports universal input, making it ideal for global applications.
8. Frequency Jittering: Reduces EMI, simplifying compliance with global standards.
9. Soft-Start: Reduces component stresses during startup.
These features make the TNY277GN suitable for use in applications such as chargers, adapters, and small appliances.

Pinout

The TNY277GN is a member of the TinySwitch-III family, which is designed for low power offline switcher applications. It is housed in an 8-pin SOIC package. The pin functions are as follows:
1. EN/UV (Enable/Undervoltage): Used for enabling the device and for undervoltage lockout.
2. BP/M (Bypass/Multi-Function): Connects an external bypass capacitor and can be used for programming current limit.
3. D (Drain): Connected to the high-voltage power MOSFET drain.
4. S (Source): Common return pin for the primary-side control circuit and high-voltage power MOSFET source.
5. S (Source): Another source pin, providing additional current carrying capability.
6. S (Source): Another source pin, providing additional current carrying capability.
7. S (Source): Another source pin, providing additional current carrying capability.
8. S (Source): Another source pin, providing additional current carrying capability.
The device integrates a 700V power MOSFET, oscillator, high-voltage switched current source, current limit state machine, and thermal shutdown circuit, making it suitable for a variety of power supply applications.

Manufacturer

The TNY277GN is manufactured by Power Integrations, Inc. Power Integrations is a semiconductor company that specializes in the design and development of high-performance electronic components used in power conversion. Their products are widely utilized in power supply systems for various applications, including consumer electronics, computers, communications, and industrial devices. Power Integrations is known for its focus on energy-efficient and environmentally-friendly power conversion technology.

Application

The TNY277GN is a highly integrated switcher IC used in power supply applications. Its primary application areas include:
1. Consumer Electronics: Power adapters and chargers for devices like smartphones, tablets, and laptops.
2. Home Appliances: Power supply for appliances such as microwaves, refrigerators, and washing machines.
3. LED Lighting: Used in LED drivers and lighting systems for efficient power conversion.
4. Industrial Electronics: Power supplies for industrial control systems and instrumentation.
5. Battery-Powered Devices: Chargers and power management in devices with rechargeable batteries.
Its compact design, high efficiency, and ability to minimize external components make it suitable for both cost-sensitive applications and designs where space is limited.

Package

The TNY277GN is a Power Integrations component typically used in power supply applications. It is housed in an 8-pin SOIC (Small Outline Integrated Circuit) package. This surface-mount package type is commonly used for integrated circuits due to its compact size and ease of assembly on printed circuit boards.