TMS320C6655CZH

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TMS320C6655CZH

+Nomenclature

IC DSP FIX/FLOAT POINT 625FCBGA

  • FabricantTexas Instruments

  • Pièce fabricant #TMS320C6655CZH

  • Package FCBGA (CZH)-625

  • En stock2929

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Spécifications

Attribut Valeur
Package Bulk,Tray
Series TMS320C66x
ProductStatus Active
Type Fixed/Floating Point
Interface DDR3, EBI/EMI, Ethernet, McBSP, PCIe, I²C, SPI, UART, UPP
ClockRate 1GHz
Non-VolatileMemory ROM (128kB)
On-ChipRAM 2.06MB
Voltage-I/O 1.0V, 1.5V, 1.8V
Voltage-Core 1.00V
OperatingTemperature 0°C ~ 85°C (TC)
MountingType Surface Mount
Package/Case 625-BFBGA, FCBGA

Présentation

Description

The TMS320C6655CZH is a high-performance DSP (Digital Signal Processor) from Texas Instruments' KeyStone multicore architecture family. It features:
- Dual-core design (C66x DSP cores), each running at up to 1.25 GHz.
- Fixed- and floating-point processing for high-speed signal computations.
- 1 MB shared L2 cache and 512 KB/core L1 memory for efficient data handling.
- Multicore Navigator for optimized inter-core communication.
- High-speed interfaces: SRIO, HyperLink, PCIe, Gigabit Ethernet.
- Low power consumption (compared to previous generations).
Applications: Wireless base stations, medical imaging, radar, and high-performance embedded computing.
The C6655CZH is ideal for real-time, compute-intensive tasks requiring parallel processing. Its BGA package (625-ball) suits compact, high-performance designs.
For more details, refer to TI’s datasheet and Technical Reference Manual (TRM).

Equivalent

The TMS320C6655CZH is a dual-core DSP from Texas Instruments. Equivalent or similar products include:
- TMS320C6657: Higher performance, dual-core DSP with more memory.
- TMS320C6654: Single-core variant of the same family.
- TMS320C6678: Multicore (8-core) DSP with higher processing power.
- TMS320C6748: Lower-cost, single-core DSP with floating-point support.
These alternatives vary in core count, speed, and features but belong to TI’s C66x DSP family. Choose based on performance needs.

Features

The TMS320C6655CZH is a high-performance DSP from Texas Instruments' KeyStone I architecture. Key features:
- Dual-core: Two C66x DSP cores, each running at 850 MHz (1.36 GHz max).
- Performance: Up to 27.2 GMACs/core and 13.6 GFLOPs/core (FP).
- Memory: 512 KB L2/core, 1 MB shared L2, and 512 KB L3. Supports DDR3 (up to 8 GB).
- Connectivity: SRIO (4x), HyperLink, PCIe Gen2, Gigabit Ethernet, and EMIF16.
- Multicore Support: Multicore Navigator for efficient inter-core communication.
- Power: 1.8–1.0V core voltage, optimized for low power.
- Applications: Wireless base stations, medical imaging, radar, and high-performance computing.
Compact 25×25 mm BGA package. Ideal for real-time signal processing.

Pinout

The TMS320C6655CZH is a DSP from Texas Instruments' KeyStone I family.
- Pin Count: 625-pin (FCBGA package).
- Core: Dual C66x DSP cores (each up to 1.25 GHz).
- Memory:
- 1MB L2/cache per core.
- 512KB shared L2.
- Supports DDR3, NOR/NAND flash.
- Interfaces:
- SRIO (Serial RapidIO).
- HyperLink (for multi-DSP connectivity).
- Ethernet (2x 1GbE).
- PCIe Gen2.
- UART, SPI, I²C.
- Applications: High-performance embedded processing (wireless, medical, industrial).
Concise and functional summary.

Application

The TMS320C6655CZH, a high-performance DSP from Texas Instruments, is widely used in:
- Wireless Communications: Base stations, LTE/5G infrastructure, and software-defined radios.
- Medical Imaging: Ultrasound, MRI, and CT scan processing.
- Industrial Automation: Motor control, robotics, and real-time monitoring.
- Defense & Aerospace: Radar, sonar, and signal intelligence systems.
- Video Surveillance: High-resolution video analytics and object detection.
Its dual-core C66x architecture and high-speed interfaces (SRIO, Ethernet) make it ideal for compute-intensive, real-time applications.

Package

The TMS320C6655CZH is packaged in a 256-pin BGA (Ball Grid Array) with a 17mm x 17mm body size. This package type ensures high-density integration and reliable performance for DSP applications. The BGA design supports efficient thermal dissipation and robust electrical connections, making it suitable for embedded and high-performance computing systems.

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