TLE8261EXUMA3

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TLE8261EXUMA3

+Nomenclature

IC TRANSCEIVER DSO36-38

  • FabricantTechnologie Infineon

  • Pièce fabricant #TLE8261EXUMA3

  • Package SOIC-36

  • En stock6678

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Spécifications

Attribut Valeur
Package Tape & Reel (TR)
ProductStatus Obsolete
Type Transceiver
Applications Automotive
MountingType Surface Mount
Package/Case 36-BSSOP (0.295, 7.50mm Width) Exposed Pad

Présentation

Description

The TLE8261EXUMA3 is a multi-functional System Basis Chip (SBC) developed by Infineon Technologies. It is designed for automotive applications, offering a high level of integration to support powertrain, safety, and body systems. This chip combines various features such as a low-dropout voltage regulator, a high-speed CAN transceiver, and multiple wake-up capabilities.
Key features of the TLE8261EXUMA3 include:
1. Voltage Regulation: It provides a 5V/100 mA voltage regulator, ensuring stable power supply for microcontrollers and other peripherals.

2. CAN Transceiver: Integrated high-speed CAN transceiver supports data rates up to 1 Mbps, essential for in-vehicle networking.
3. Wake-Up Functions: Offers various wake-up sources including cyclic wake, bus wake, and local wake to efficiently manage power consumption.
4. Diagnostics and Protection: Equipped with diagnostic features and protection mechanisms such as thermal shutdown, short circuit protection, and load dump protection.
The TLE8261EXUMA3 is suitable for applications where space-saving and efficiency are crucial, providing a robust solution for modern automotive electronic systems.

Equivalent

The TLE8261EXUMA3 is a system basis chip (SBC) designed by Infineon Technologies for automotive applications. Equivalent products from other manufacturers might include the NXP FS6500 or the Texas Instruments TPS65381A-Q1, which are also SBCs for automotive use. However, exact equivalency depends on specific requirements and features like power, communication interfaces, and safety standards. Always compare the datasheets for detailed specifications to ensure compatibility.

Features

The TLE8261EXUMA3 is an advanced system basis chip (SBC) designed for automotive applications, manufactured by Infineon Technologies. Key features include:
1. Microcontroller Interface: It supports a versatile SPI interface for communication with microcontrollers, enabling efficient data exchange.
2. Voltage Regulation: The chip includes a robust voltage regulator to power microcontrollers and other components with precision, ensuring stable operation.
3. Multi-channel Output: Offers multiple output channels to drive different loads, with protection features for overload and short circuit conditions.
4. Diagnostics and Protection: Equipped with diagnostic features for fault detection and protection mechanisms to guard against over-temperature, over-current, and under-voltage conditions.
5. Low Power Modes: Provides low-power modes to reduce energy consumption during periods of inactivity, contributing to overall system efficiency.
6. LIN Transceiver: Includes a LIN (Local Interconnect Network) transceiver for communication in automotive networks.
7. Robustness and Reliability: Built to withstand harsh automotive environments, with high immunity to electromagnetic interference and protection against load dump.
This combination of features makes the TLE8261EXUMA3 suitable for a wide range of automotive control applications.

Pinout

The TLE8261EXUMA3 is a multi-channel power management IC (PMIC) developed by Infineon Technologies. It typically comes in a VQFN-48 package, meaning it has 48 pins. This IC is designed for automotive applications and integrates multiple functions to support microcontroller systems, including:
1. Voltage Regulators: Provides multiple regulated outputs for powering microcontrollers and peripherals.
2. Switching and Linear Regulators: Offers efficient power conversion and distribution.
3. Supervisory Functions: Includes monitoring features for undervoltage and overvoltage conditions.
4. Watchdog Timer: Ensures system integrity by resetting the microcontroller in case of malfunctions.
5. Voltage Monitoring: Tracks various voltage levels to ensure the system operates within specified limits.
6. Wake-up Functions: Manages the power-up sequence and can wake the system from low-power modes.
7. Communication Interfaces: Supports protocols like SPI for interfacing with microcontrollers.
The TLE8261EXUMA3 is ideal for automotive body and safety applications due to its robust feature set and compliance with automotive standards.

Manufacturer

The TLE8261EXUMA3 is manufactured by Infineon Technologies AG. Infineon is a leading semiconductor company that specializes in designing, developing, and manufacturing a wide range of electronic components and systems. Headquartered in Neubiberg, Germany, Infineon is known for its expertise in power semiconductors, microcontrollers, sensors, and secure communications. The company operates across various sectors, including automotive, industrial power control, power management and multimarket, and digital security solutions. Infineon is recognized for its commitment to innovation, quality, and sustainability, providing semiconductor solutions that contribute to energy efficiency, mobility, and security.

Application

The TLE8261EXUMA3 is an automotive System Basis Chip (SBC) designed for efficient power management and communication in various vehicle electronic control units (ECUs). Its application areas include powertrain control, body control modules, transmission control units, and safety systems like airbag and ABS control. Additionally, it supports LIN and CAN communication protocols, making it suitable for applications requiring robust in-vehicle networking. The chip is also used in systems that need efficient voltage regulation, wake-up functions, and diagnostic capabilities, enhancing overall vehicle performance and reliability. Its integration features help reduce component count, improving design simplicity and space efficiency in automotive systems.

Package

The TLE8261EXUMA3 is typically housed in a PG-DSO-36 package. This is a plastic dual small outline package with 36 leads, designed for automotive applications, ensuring optimal thermal and electrical performance.

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