TH58NVG3S0HBAI4

TH58NVG3S0HBAI4 looks like a semiconductor part number, likely a non-volatile storage device (most probably NAND flash memory) from a major vendor (the “TH” prefix is commonly seen with Toshiba/TM parts). It would be used to store firmware and user data in devices such as embedded systems, SSDs, USB drives, and consumer electronics.
What you can expect in this category (without assuming this exact part’s specs):
- Memory type: NAND flash (non-volatile)
- Typical use: bulk storage in devices, firmware storage, data buffering
- Possible architecture: 3D NAND, various page/block sizes, voltage ranges typical for flash devices
- Density and performance vary by exact family
To get precise information:
- Look up the exact part number on the manufacturer’s website or datasheet repository
- Check marking guides and cross-reference tables from distributors
- If you have a device context (board, controller), I can help interpret the relevant specs once you provide them.

- Pin count: 196-pin BGA (FBGA196).
- Function: 3D NAND flash memory device (non-volatile storage) from Toshiba/Kioxia, accessed via a standard NAND flash interface.

- Manufacturer: Toshiba Memory Corporation, now branded as Kioxia.
- What kind of company: A Japanese multinational semiconductor company specializing in flash memory and solid-state storage solutions.

TH58NVG3S0HBAI4 is a NAND flash memory die (non-volatile storage). Typical application areas include:
- Solid-state drives (SATA/NVMe) for consumer and enterprise storage
- USB flash drives and memory cards (SD/microSD)
- Embedded storage modules (eMMC/UFS) for mobile, tablets, and IoT
- Automotive and in-vehicle infotainment systems
- Cameras, set-top boxes, and other consumer electronics
- Edge/industrial systems requiring dense, persistent storage with controller support
Note: Uses with an appropriate flash controller are required for full operation.

FBGA (Flip-Chip Ball Grid Array) package.