TC358779XBG

The TC358779XBG is a high-performance display interface bridge developed by Toshiba. It's designed to enable the interconnection between devices with different interfaces, specifically from MIPI DSI (Display Serial Interface) to eDP (Embedded DisplayPort). This makes it particularly useful in applications where a processor or GPU outputs video using the MIPI DSI standard, but the display panel accepts eDP.
Key features of the TC358779XBG include support for high-resolution displays, efficient power management, and a small package size, making it suitable for compact electronic devices like tablets, notebooks, and convertibles. It supports video resolutions up to 4K at 30Hz, which allows for high-definition visual output.
Additionally, the chip is designed to handle the complexities of translating between the two interfaces with minimal latency and power consumption, ensuring smooth display performance. This makes the TC358779XBG a valuable component in modern electronic design, facilitating compatibility between diverse hardware components within mobile and portable computing devices.

The TC358779XBG is a Toshiba HDMI to MIPI DSI bridge chip. Equivalent products include the Lontium LT8918B, Parade Technologies PS8640, and the Analogix ANX7625. These chips serve similar functions by facilitating the conversion from HDMI to MIPI DSI, commonly used in display interfaces for portable devices. Always check the specific requirements and datasheets to ensure compatibility with your application.

The TC358779XBG is a high-performance bridge chip designed by Toshiba. It primarily serves the function of converting MIPI DSI (Mobile Industry Processor Interface Display Serial Interface) signals to HDMI (High-Definition Multimedia Interface) outputs. This makes it ideal for integrating mobile displays with HDMI-equipped devices such as monitors and televisions.
Key features of the TC358779XBG include:
1. MIPI DSI Input: Supports up to four data lanes with a maximum data rate of 1 Gbps per lane.
2. HDMI Output: Compatible with HDMI 1.4 standards, supporting resolutions up to 1080p at 60Hz.
3. Color Formats: Supports RGB/YUV 444 and YUV 422 color formats, ensuring versatile video output options.
4. Audio Support: Provides up to 8-channel I2S audio, handling standard and high-definition audio signals.
5. Low Power Consumption: Designed for efficient power use, making it suitable for portable devices.
6. Compact Package: Offered in a small 5mm x 5mm package, allowing it to fit in compact electronic designs.
These features make the TC358779XBG suitable for applications requiring efficient and compact video signal conversion.

The TC358779XBG is a bridge IC designed by Toshiba that serves as a converter between MIPI DSI (Display Serial Interface) or DPI (Display Parallel Interface) inputs and HDMI (High-Definition Multimedia Interface) outputs. It is commonly used in applications such as tablets, smartphones, and other devices that require video output conversion.
The TC358779XBG comes in a 121-ball FBGA (Fine-Pitch Ball Grid Array) package. This package format indicates the device has 121 pins (or balls) that establish electrical connections with the printed circuit board (PCB). The device supports MIPI DSI interfaces with up to four data lanes and incorporates a high-speed HDMI 1.4 transmitter, which is suitable for full HD 1080p video at 60 frames per second, 3D video formats, and other HDMI features.
In summary, the TC358779XBG is a 121-pin IC that functions as a bridge between MIPI DSI/DPI inputs and HDMI outputs, facilitating video signal conversions in various electronic devices.

The TC358779XBG is manufactured by Toshiba Corporation. Toshiba is a Japanese multinational conglomerate headquartered in Tokyo, Japan. The company operates in a wide range of business sectors, including electronics, information technology, communications equipment, and more. Toshiba is known for its innovations and contributions to the electronics industry, producing a variety of products including semiconductors, storage devices, and consumer electronics. The TC358779XBG is a part of Toshiba's semiconductor product line, which focuses on delivering high-performance components for various applications such as mobile devices, automotive, and industrial equipment.

The TC358779XBG is a display bridge IC commonly used in electronic devices to interface between different display panel technologies. Its primary application areas include smartphones, tablets, laptops, and other portable consumer electronics that require high-resolution display panels. This IC supports conversion between various display interfaces such as MIPI DSI (Display Serial Interface) and LVDS (Low-Voltage Differential Signaling). It facilitates the integration of high-resolution displays by ensuring compatibility and efficient data transfer between system-on-chip (SoC) components and display panels. Additionally, it can be used in automotive infotainment systems and industrial displays where advanced display interfacing is required.

The TC358779XBG is a Toshiba IC package, specifically a 121-ball Wafer-Level Chip-Scale Package (WLCSP). This type of packaging is compact, suitable for applications where space is a premium, such as in mobile devices and other compact electronics.