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SIC534CD-T1-GE3
+NomenclatureIC POWER STAGE 30A POWERPAK MLP4
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FabricantSiliconix
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Pièce fabricant #SIC534CD-T1-GE3
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Package QFN
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En stock6566
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Spécifications
| Attribut | Valeur |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | VRPower® |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| LoadType | Inductive |
| Technology | Power MOSFET |
| Current-Output/Channel | 30A |
| Current-PeakOutput | 35A |
| Voltage-Supply | 4.5V ~ 5.5V |
| Voltage-Load | 4.5V ~ 24V |
| OperatingTemperature | -40°C ~ 150°C (TJ) |
| Features | Bootstrap Circuit, Diode Emulation |
| FaultProtection | UVLO |
| MountingType | Surface Mount |
| Package/Case | PowerPAK® MLP4535-22L |
Présentation
Description
- What it is: device type and function (e.g., power-management IC, LED driver, switch/motor driver) and the manufacturer.
- Key specs: supply/operating voltage, input/output pins, control interface, current/voltage limits, protections (short-circuit, thermal), package.
- Architecture: block diagram, main features, and any onboard regulators or controllers.
- Package/thermal: package type, pinout, thermal characteristics.
- Applications: typical use cases and design notes; references to evaluation kits.
Equivalent
Pinout
- Paste a link to the manufacturer datasheet, or
- Upload or paste the pinout/table from the datasheet,
and I will concisely summarize the pin count and each pin’s function.