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SI9910DY-T1-E3
+NomenclatureIC GATE DRVR HIGH-SIDE 8SOIC
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FabricantSiliconix
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Pièce fabricant #SI9910DY-T1-E3
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Fiche technique SI9910DY-T1-E3 DataSheet
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Package SOIC-8
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En stock5001
365 Garantie qualité 24h/24
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Spécifications
| Attribut | Valeur |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Obsolete |
| DrivenConfiguration | High-Side |
| ChannelType | Single |
| NumberofDrivers | 1 |
| GateType | N-Channel MOSFET |
| Voltage-Supply | 10.8V ~ 16.5V |
| Current-PeakOutput(SourceSink) | 1A, 1A |
| InputType | Non-Inverting |
| HighSideVoltage-Max(Bootstrap) | 500 V |
| Rise/FallTime(Typ) | 50ns, 35ns |
| OperatingTemperature | -40°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Présentation
Description
The SI9910DY-T1-E3 features a fast switching speed, which helps improve overall system efficiency by reducing switching losses. Its compact surface-mount package (typically in SO-8) facilitates easy integration into densely packed circuit boards, ideal for space-constrained applications. The low gate charge contributes to lower power losses and enhances the device's performance in high-frequency applications.
This MOSFET is commonly employed in DC-DC converters, load switches, and other power supply circuits. Its robust design and electrical characteristics make it a reliable choice for designers aiming to optimize power efficiency and reduce thermal stress in their electronic devices.
Equivalent
1. MIC4422 from Microchip Technology – Dual High-Speed MOSFET Driver.
2. TC4422 from Microchip Technology – High-Speed MOSFET Driver.
3. IRS4427 from Infineon Technologies – Dual High-Speed Power MOSFET/IGBT Driver.
4. FAN3224 from ON Semiconductor – Dual 4A High-Speed Low-Side Gate Driver.
These equivalents offer similar functionality but be sure to check specific parameters for compatibility.
Features
1. Low On-Resistance: This MOSFET offers low R_DS(on), which minimizes power loss and improves efficiency.
2. Fast Switching Speed: It provides rapid switching capabilities, enhancing performance in high-frequency applications.
3. Thermal Management: The device is equipped with a robust package that aids in efficient heat dissipation, supporting higher power applications.
4. High Power Density: The compact design allows for efficient use of space in densely packed circuits.
5. Robust Design: It features a rugged design that ensures reliability and durability in demanding environments.
6. Complementary Silicon Technology: The device utilizes advanced silicon technology, providing superior electrical characteristics.
These features make the SI9910DY-T1-E3 suitable for a range of applications, including power management in portable devices, DC-DC converters, and motor control systems.
Pinout
1. VDD: Supply voltage input.
2. GND: Ground connection.
3. IN: Input signal for controlling the output stages.
4. NC: No internal connection. Often used for mechanical support or optional functions.
5. PGND: Power ground, typically connected to the source of the power MOSFET.
6. OUT: Output to drive the gate of the MOSFET.
7. VSS: Negative supply voltage for the driver.
8. NC: Another pin with no internal connection.
This driver is designed for high-frequency switching applications and can efficiently drive MOSFET gates to optimize their performance in power conversion circuits.