RK805-1

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RK805-1

+Nomenclature

  • FabricantLe rockchip

  • Pièce fabricant #RK805-1

  • Fiche technique RK805-1 DataSheet

  • En stock29901

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Spécifications

Attribut Valeur
Manufacturer Rockchip
Package QFN-32-EP(4x4)

Présentation

Description

The RK805-1 is a specific model within the RK805 series, commonly associated with power management integrated circuits (PMICs) used in electronic devices. It is designed to regulate and distribute power efficiently, often found in consumer electronics, embedded systems, or industrial applications.
Key features may include:
- Multi-channel voltage regulation (e.g., for CPUs, GPUs, or peripherals).
- Low power consumption and high efficiency.
- Programmable settings for flexible power management.
- Protection mechanisms (overvoltage, overcurrent, thermal shutdown).
Exact specifications depend on the manufacturer (e.g., Rockchip or others). For precise details, consult the datasheet or product documentation.

Equivalent

The RK805-1 is a power management IC (PMIC) from Rockchip. Equivalent alternatives include:
- ACT8846 (Active-Semi)
- RT5033 (Richtek)
- MAX77650 (Maxim Integrated)
- BD71837AMWV (ROHM)
These PMICs offer similar voltage regulation and power sequencing for embedded systems. Compatibility depends on the specific application and pinout. Always verify datasheets for exact replacements.

Features

The RK805-1 is a compact, high-performance power management IC (PMIC) designed for Rockchip SoCs, commonly used in tablets and embedded systems. Key features include:
- Input Voltage Range: 2.7V to 5.5V, suitable for Li-ion batteries.
- Multiple Outputs: Integrates DC-DC buck converters (e.g., 1.1V, 1.5V, 3.3V) and LDOs for stable power delivery.
- High Efficiency: Up to 95% efficiency with synchronous rectification.
- Low Power Consumption: Supports dynamic voltage scaling (DVS) for power optimization.
- Protections: Over-current, over-voltage, under-voltage, and thermal shutdown.
- I²C Interface: Programmable output voltages and power sequencing.
- Compact Package: Small QFN or BGA footprint for space-constrained designs.
Ideal for Rockchip-based devices like RK3288 or RK3399, it ensures reliable, efficient power management.

Pinout

The RK805-1 is a power management IC (PMIC) designed for Rockchip SoCs, commonly used in tablets and embedded systems.
- Pin Count: Typically 68-pin (exact count may vary by package, e.g., QFN-68).
- Functions:
- Multi-channel DC-DC converters (buck/boost) for core, memory, and I/O voltages.
- LDO regulators for low-noise power domains.
- Battery charging support (if integrated).
- Power sequencing and voltage monitoring.
- I²C/SPI interface for control.
It efficiently manages power distribution to CPUs, GPUs, and peripherals. Check the datasheet for precise pinout and variant-specific details.

Manufacturer

The RK805-1 is manufactured by Rockchip, a Chinese semiconductor company specializing in system-on-chip (SoC) solutions for consumer electronics. Founded in 2001 and headquartered in Fuzhou, Rockchip is known for producing cost-effective, low-power processors used in tablets, smart TVs, IoT devices, and multimedia applications. The RK805-1 is a power management IC (PMIC) designed to complement Rockchip's SoCs, ensuring efficient power delivery in embedded systems. The company collaborates with global tech firms but primarily serves the Asian market.

Application

The RK805-1 is a high-performance microcontroller chip primarily used in:
1. Consumer Electronics – Smart home devices, wearables, and IoT products.
2. Industrial Control – Automation systems, motor control, and sensors.
3. Automotive – Infotainment, ADAS, and vehicle control modules.
4. Communication – Routers, gateways, and wireless modules.
5. Embedded Systems – Low-power, real-time applications.
Its efficiency, reliability, and integration capabilities make it suitable for diverse embedded solutions.

Package

The RK805-1 is typically packaged in a QFN (Quad Flat No-leads) or BGA (Ball Grid Array) format, depending on the manufacturer. These compact, surface-mount packages are designed for efficient heat dissipation and high-density PCB integration. For exact specifications, refer to the datasheet or supplier documentation.

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