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PI6C18551WE
+NomenclatureIC CLK BUFFER 1:4 160MHZ 8SOIC
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FabricantLa société diodes
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Pièce fabricant #PI6C18551WE
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Package 8-SOIC
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En stock1792
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
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Spécifications
| Attribut | Valeur |
| Package | Tube |
| ProductStatus | Obsolete |
| Type | Fanout Buffer (Distribution) |
| NumberofCircuits | 1 |
| Ratio-Input:Output | 1:4 |
| Differential-Input:Output | No/No |
| Input | CMOS, TTL |
| Output | CMOS, TTL |
| Frequency-Max | 160 MHz |
| Voltage-Supply | 3.135V ~ 5.25V |
| OperatingTemperature | -40°C ~ 85°C |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Présentation
Description
Key features:
- Input: Supports 25MHz crystal or LVCMOS reference.
- Outputs: Up to 9 differential HCSL pairs (configurable for PCIe).
- Low power: Typically consumes <100mW.
- Low jitter: <1ps RMS (phase jitter).
- Spread Spectrum Clocking (SSC) support for EMI reduction.
- Industrial temperature range (-40°C to +85°C).
Applications include servers, storage, networking, and embedded systems requiring PCIe clocking. The PI6C18551WE comes in a 24-pin TSSOP package, offering a compact and reliable solution.
For detailed specs, refer to the datasheet from Diodes Incorporated.
Pinout
Key Features:
- Input: Single-ended or differential (3.3V/2.5V).
- Outputs: Two configurable differential pairs (LVPECL, LVDS, or HCSL).
- Spread Spectrum Modulation (SSM) for EMI reduction.
- Industrial temperature range (-40°C to +85°C).
Applications: Networking, telecom, and embedded systems requiring precise clock distribution.
Package: 16-pin TSSOP (Exposed Pad).
Application
- Computing: Motherboards, servers, and workstations.
- Networking: Routers, switches, and communication equipment.
- Storage: SSDs, HDDs, and RAID controllers.
- Embedded Systems: Industrial automation and IoT devices.
- Consumer Electronics: Smart TVs, gaming consoles.
It provides low-jitter, high-frequency clock signals, ensuring reliable performance in high-speed data transfer and processing systems.