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PC28F512P33BFD
+NomenclatureIC FLASH 512MBIT PARALLEL 64LBGA
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FabricantAlliance Memory, Inc.
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Pièce fabricant #PC28F512P33BFD
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En stock2479
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Base Product Number | PC28F512 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 512Mbit |
| Memory Organization | 32M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 52 MHz |
| Voltage - Supply | 2.3V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 64-LBGA |
| Supplier Device Package | 64-LBGA (11x13) |
| Packaging | Tray |
| Access Time | 95 ns |
Présentation
Description
Key features include a typical access time of 33 ns, a 3.0V to 3.6V operating voltage range, and support for multiple programming and erasing cycles. The chip often interfaces through standard protocols like Parallel or Serial Peripheral Interface (SPI), allowing for easy integration into various electronic systems.
Suitable for applications such as digital cameras, mobile phones, and automotive systems, it provides reliable data storage and retention. The PC28F512P33BFD is characterized by its endurance and data retention capabilities, making it ideal for applications that require long-term data storage without power.
Equivalent
1. Intel 28F512P30B
2. Micron MT28F512P30
3. STMicroelectronics M29W512
4. AMD AM29LV512
These alternatives share similar specifications and performance characteristics, but it's important to verify compatibility for specific applications.
Features
1. Memory Density: Offers 512Mb of storage capacity.
2. Interface: Utilizes a parallel interface for easy integration with various systems.
3. Access Speed: Supports high-speed access with a 33ns read cycle time.
4. Block Erase: Features block-level erase capability, allowing for efficient data management.
5. Endurance: Rated for a significant number of program/erase cycles (typically around 10,000 cycles).
6. Data Retention: Ensures data retention for several years under proper conditions (usually around 10 years).
7. Cell Architecture: Utilizes a multi-level cell (MLC) architecture for improved storage density.
8. Low Power Consumption: Designed for efficient power usage, making it suitable for mobile and embedded applications.
This combination of features makes the PC28F512P33BFD ideal for applications in consumer electronics, automotive, and industrial sectors.
Pinout
1. Address Lines (A0-A20): These pins are used for addressing memory locations.
2. Data Lines (DQ0-DQ7): These pins facilitate data input and output.
3. Control Signals:
- CE# (Chip Enable): Activates the chip.
- WE# (Write Enable): Initiates write operations.
- RE# (Read Enable): Initiates read operations.
- OE# (Output Enable): Controls data output.
4. Ready/Busy (R/B#): Indicates the status of the device (busy or ready).
5. Vcc and Vss: Power supply and ground connections.
This device is commonly used in various applications, including consumer electronics, computing, and automotive systems.
Manufacturer
The specific product, PC28F512P33BFD, is a type of flash memory device, specifically a NOR flash memory, used for storing firmware and other critical data in various electronic devices. Intel's expertise in memory technology has made it a key provider of solutions for applications ranging from consumer electronics to enterprise-level computing.
In addition to memory products, Intel is also involved in developing processors, integrated circuits, and various other technologies that drive advancements in computing, data centers, and artificial intelligence. The company continually invests in research and development to innovate and maintain its leadership position in the tech industry.
Application
1. Consumer Electronics: Storing firmware and software in devices like smartphones, tablets, and digital cameras.
2. Automotive: Used in engine control units (ECUs) for firmware storage and updates.
3. Industrial Equipment: In programmable logic controllers (PLCs) and machinery for storing operational code and data.
4. Networking Devices: For firmware in routers, switches, and access points.
5. Embedded Systems: In medical devices and IoT applications for reliable data storage and retrieval.
Its non-volatile nature makes it suitable for applications requiring data retention without power supply.
Package
Frequently Asked Questions
Q: What is the memory density and organization of the PC28F512P33BFD?
A: It is a 512Mbit NOR Flash memory organized as 32M x 16 bits, accessible via a parallel interface.
Q: Is this component suitable for high-speed read operations?
A: Yes, it supports a clock frequency up to 52 MHz and has an access time as low as 95 ns for random reads.
Q: What are the voltage and temperature operating ranges?
A: It operates from 2.3V to 3.6V supply voltage and is rated for industrial temperature range from -40°C to +85°C.
Q: Can this device be used for code execution in embedded systems?
A: Yes, as a NOR Flash with parallel interface, it is ideal for execute-in-place (XIP) code storage in embedded systems.
Q: What package type is available for this memory IC?
A: It comes in a 64-LBGA package with a supplier device package size of 11x13 mm, suitable for surface mount assembly.
Q: Is this component still in active production?
A: No, the part status is listed as Obsolete, so it is recommended for legacy designs or while existing stock lasts.
Q: Does this memory support multiple read modes?
A: As a standard parallel NOR Flash, it supports page, burst, and random read modes typical for high-performance applications.
