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NTF2955T1G
+NomenclatureMOSFET P-CH 60V 1.7A SOT223
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FabricantSemi - conducteurs
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Pièce fabricant #NTF2955T1G
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Package SOT-223-4
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En stock6023
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Spécifications
| Attribut | Valeur |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| FET Type | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 60 V |
| Current - Continuous Drain(Id) @ 25°C | 1.7A (Ta) |
| Drive Voltage(Max Rds On Min Rds On) | 10V |
| Rds On(Max) @ Id Vgs | 185mOhm @ 2.4A, 10V |
| Vgs(th)(Max) @ Id | 4V @ 1mA |
| Gate Charge(Qg)(Max) @ Vgs | 14.3 nC @ 10 V |
| Vgs(Max) | ±20V |
| Input Capacitance(Ciss)(Max) @ Vds | 492 pF @ 25 V |
| Power Dissipation (Max) | 1W (Ta) |
| Operating Temperature | -55°C ~ 175°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | SOT-223 (TO-261) |
Présentation
Description
Key features of the NTF2955T1G include:
1. Voltage and Current Ratings: It typically operates at a drain-source voltage (V_DS) of up to 60V and can handle a continuous drain current (I_D) of around 12A, making it suitable for medium power applications.
2. Low On-Resistance: The device offers a low on-state resistance, which enhances efficiency by reducing power loss during operation.
3. Package Type: It is available in surface-mount packages, such as the SOT-223, which allows for compact circuit designs.
4. Thermal Performance: The device is designed to efficiently dissipate heat, ensuring reliability and stability in thermal management.
Overall, the NTF2955T1G is a versatile component widely used in various electronic applications requiring efficient switching and amplification.
Equivalent
1. IRF9540 by Infineon Technologies.
2. FQP27P06 by ON Semiconductor.
3. STP55PF06 by STMicroelectronics.
4. FDP7030BL by Fairchild Semiconductor.
Ensure compatibility in terms of voltage, current, and package before making substitutions. Always refer to datasheets for exact specifications.
Features
1. Voltage and Current Ratings: It supports a drain-source voltage (V_DS) of -60V and a continuous drain current (I_D) of -12A, making it suitable for medium power applications.
2. R_DS(on): It has a low on-state resistance, ensuring minimal power loss when the MOSFET is in the conducting state.
3. Package Type: Available in a compact SOT-223 surface mount package, which is ideal for space-constrained designs.
4. Thermal Performance: The package provides efficient heat dissipation, enhancing the device's reliability and performance under load.
5. Applications: Commonly used in DC-DC converters, power management systems, and load switching applications.
6. Production and Reliability: Manufactured by ON Semiconductor, ensuring quality and consistency in performance.
These features make the NTF2955T1G a versatile and efficient choice for various electronic applications involving power management and control.
Pinout
Pin Count and Functions:
1. Pin 1 (Gate): This is the control terminal for the MOSFET. A voltage applied here regulates the current flow between the source and the drain.
2. Pin 2 (Drain): The primary current-carrying terminal. It is the terminal through which the load current enters the device.
3. Pin 3 (Source): The terminal through which the load current exits the device. It is typically connected to ground in P-channel MOSFET applications.
4. Pin 4 (Tab/Drain): This is connected internally to the drain and provides a thermal path for heat dissipation.
The NTF2955T1G is used in various applications, including power management, load switching, and in systems requiring efficient power usage.