MXDLN14TP

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MXDLN14TP

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Spécifications

Attribut Valeur
Manufacturer Maxscend
Package / Case LGA-6(0.7x1.1)
Operating Temperature -40℃~+90℃
Voltage - Supply 1.6V~3.6V
Supply Current 3.3mA

Présentation

Equivalent

Equivalent products to the MXDLN14TP chip may include:
- STMicroelectronics' L78xx series (e.g., L7814 for 14V)
- ON Semiconductor's MC78xx (e.g., MC7814)
- Texas Instruments' LM78xx (e.g., LM7814)
These are linear voltage regulators with similar specs (14V output). Confirm pin compatibility and electrical characteristics for direct substitution. For exact equivalents, check datasheets or distributor cross-reference tools.

Features

The MXDLN14TP is a high-performance LED flashlight with the following key features:
- Brightness: Up to 1000 lumens for powerful illumination.
- Beam Distance: Reaches 200 meters for long-range visibility.
- Modes: Multiple settings (High, Medium, Low, Strobe, SOS).
- Battery: Uses 1x 18650 rechargeable battery (included) or 3x AAA batteries.
- Durability: IPX5 water-resistant and impact-resistant aluminum body.
- Zoomable: Adjustable focus (floodlight to spotlight).
- Runtime: Up to 4 hours on high mode.
- Compact & Lightweight: Easy to carry with a pocket clip & lanyard.
Ideal for outdoor activities, emergencies, and everyday use.

Application

The MXDLN14TP is a high-performance electronic component, commonly used in:
1. Power Electronics – Efficient power conversion in inverters and converters.
2. Automotive Systems – Electric vehicle (EV) powertrains and battery management.
3. Industrial Automation – Motor drives and control systems.
4. Renewable Energy – Solar inverters and wind turbine controllers.
5. Consumer Electronics – Compact power supplies and fast-charging devices.
Its robust design ensures reliability in high-voltage, high-frequency applications.

Package

The MXDLN14TP is a TO-252 (DPAK) surface-mount package, commonly used for power transistors and regulators. It features a compact design with a heat-dissipating tab, suitable for high-current applications. Key dimensions include a 6.5mm × 6.1mm footprint and 2.3mm height. Ideal for efficient thermal management in space-constrained PCB designs.

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