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MTFC4GACAJCN-1M WT
+Nomenclature4GB MLC eMMC 5.0 VFBGA-153(11.5x13) Memory (ICs) RoHS
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FabricantMicromètres
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Pièce fabricant #MTFC4GACAJCN-1M WT
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En stock9312
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
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Spécifications
| Attribut | Valeur |
| Packaging | VFBGA-153(11.5x13) |
| Controller Operating Voltage (VCCQ) | 1.65V~1.95V;2.7V~3.6V |
| Controller Stand - By Current | 230uA |
| Interface | eMMC 5.0 |
| Memory Size | 4GB |
| NAND Operating Voltage (VCCF) | 2.7V~3.6V |
| NAND Stand - By Current | 35uA |
| Operating Temperature | -25℃~+85℃ |
| Reading Speed in Sequence | 160MB/S |
| Writing Speed in Sequence | 14MB/S |
| configuration | MLC |
Présentation
Description
Equivalent
1. Samsung's KLMBG4GEAC-B001
2. Kingston's EMMC04G-M627
3. SanDisk's SDINBDA4-4G
These alternatives offer similar storage solutions for embedded applications. Always confirm compatibility with your specific device requirements.
Features
1. Storage Capacity: 4GB of NAND flash memory, suitable for a variety of applications in consumer electronics.
2. Interface: Compliant with JEDEC eMMC 5.0, providing a standard interface for embedded memory.
3. Performance: Offers improved read and write speeds compared to previous standards, enhancing data transfer rates and system responsiveness.
4. NAND Type: Uses MLC (Multi-Level Cell) NAND flash technology, balancing performance and cost efficiency.
5. Reliability: Includes error correction coding (ECC) and wear leveling to prolong the device's lifespan and maintain data integrity.
6. Operating Temperature: Designed to function efficiently within the industrial temperature range, making it suitable for use in various environmental conditions.
7. Power Consumption: Optimized for low power consumption, which is beneficial for battery-powered devices.
These features make the MTFC4GACAJCN-1M WT a versatile choice for embedded systems requiring reliable and efficient storage solutions.
Pinout
The MTFC4GACAJCN-1M WT package comes with a Ball Grid Array (BGA) configuration. It commonly features a 153-ball FBGA package, which is the typical pin count for eMMC modules. These balls or pins are responsible for the interface and connections, including power supply, data transfer, and command signals.
As for the functions, the eMMC module integrates NAND flash memory with a controller and firmware in a single package. It supports features like wear leveling, bad block management, and error correction to ensure data integrity and longevity. The eMMC interface simplifies the integration process by providing a managed NAND solution with an easy-to-use interface for designers.
For precise technical specifications, always refer to the manufacturer's datasheet for the MTFC4GACAJCN-1M WT.