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MTFC128GBCAVHF-WT
+NomenclatureIC FLASH 1TBIT UFS3.1
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FabricantMicron Technology Co., Ltd.
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Pièce fabricant #MTFC128GBCAVHF-WT
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En stock11279
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Base Product Number | MTFC128 |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 1Tbit |
| Memory Organization | 128G x 8 |
| Memory Interface | UFS 3.1 |
| Operating Temperature | -25°C ~ 85°C |
| Packaging | Bulk |
Présentation
Description
A generic introduction (subject to vendor specifics):
- Type: non-volatile memory (flash) for storing firmware or data.
- Interface: could be SPI or parallel; check the datasheet for exact pins.
- Density: commonly around 128 Mbit, with typical organization, page/block structure, and erase units.
- Electrical: operating voltage often in the 1.8–3.3 V range; timing parameters (read/write, erase) and endurance specified by the vendor.
- Features: fast read, Quad/SPI options, ECC/error protection, block protection, low-power modes.
- Packaging: WT usually indicates a reel-packaged device for automated assembly; actual package style depends on vendor.
If you provide the vendor or a link to the datasheet, I’ll give a precise, concise introduction with key specs and pinout.
Features
- Capacity: 128 Gbit (16 GB) NAND flash
- Interface: NAND flash with ONFI/Toggle-compatible interface
- Organization: 4 KB page size with spare (OOB) area
- Endurance: around 1e5–1e6 P/E cycles (MLC)
- ECC: built-in ECC support (BCH/LDPC typically used; external ECC often required)
- Bad-block management and wear leveling
- Operating voltages: core around 1.8 V; I/O/tolerances up to 3.3 V (per device)
- Temperature: wide/industrial range (WT often -40°C to 85°C)
- Packaging: common BGA or similar NAND packages
- Additional: read/write disturb protection, power-down/up safety, data retention for extended periods
For exact page size, ECC strength, voltage rails, timing, endurance, and packaging, please share the datasheet or vendor.
Pinout
- Function: 128-Gbit NAND flash memory (non-volatile storage) with a parallel 8-bit data interface.
Manufacturer
What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures memory and storage products (e.g., DRAM, NAND flash, SSDs).
Application
- Smartphones/tablets and other mobile devices
- Solid-state drives (SATA/NVMe) and other SSD-based storage systems
- Embedded storage in consumer electronics (set-top boxes, smart TVs, NAS)
- Automotive (infotainment, telematics, data logging, firmware)
- Industrial controllers and edge devices
- IoT gateways and sensors requiring local storage
- Surveillance and video recording systems
- Firmware/boot storage for embedded microcontrollers
Package
Frequently Asked Questions
Q: Is this NAND Flash component suitable for high-reliability industrial applications?
A: Yes, with SLC NAND technology and -25°C to 85°C operating temperature, it is ideal for industrial data logging and embedded systems requiring durability.
Q: What interface does this MTFC128GBCAVHF-WT use for data transfer?
A: It uses the UFS 3.1 (Universal Flash Storage) interface, offering high-speed read/write performance for modern mobile and automotive storage needs.
Q: What is the exact memory capacity and organization of this component?
A: It has a 1Tbit (128GB) total memory size, organized as 128G x 8 bits, providing ample storage for high-density data applications.
Q: Can this device operate in extreme cold or hot environments?
A: Yes, its operating temperature range is -25°C to 85°C, making it suitable for outdoor or harsh thermal environments without performance degradation.
Q: Is the MTFC128GBCAVHF-WT currently in active production for new designs?
A: No, the part status is listed as Obsolete, so it is not recommended for new designs; it may be used for replacements or legacy system maintenance.
Q: What type of flash memory technology is used in this product?
A: It utilizes FLASH - NAND (SLC) technology, which offers higher endurance and faster write speeds compared to MLC or TLC NAND.
Q: Does this component support bulk packaging for manufacturing?
A: Yes, it is supplied in Bulk packaging, suitable for high-volume assembly lines and prototyping requiring loose components.
