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MT62F4G32D8DV-023 WT:C
+NomenclatureDRAM LPDDR5 128Gbit 32 315/315 LFBGA 8 WT
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FabricantMicromètres
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Pièce fabricant #MT62F4G32D8DV-023 WT:C
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En stock29308
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Spécifications
| Attribut | Valeur |
| Packaging | Tray |
| Standard Pack Qty | 1050 |
Présentation
Equivalent
The MT62F4G32D8DV-023 WT:C is a Micron LPDDR4X DRAM chip. Equivalent products include:
- Samsung K4UBE3D4AA-MGCL
- SK Hynix H9HCNNNBKMMLXR-NEE
- Micron MT62F1G32D4DR-031 WT (lower density).
These are LPDDR4X chips with similar specs (32Gb, 4266 Mbps). Always verify pin compatibility and timing parameters for exact replacements. For alternatives, check Micron's cross-reference or distributor databases.
- Samsung K4UBE3D4AA-MGCL
- SK Hynix H9HCNNNBKMMLXR-NEE
- Micron MT62F1G32D4DR-031 WT (lower density).
These are LPDDR4X chips with similar specs (32Gb, 4266 Mbps). Always verify pin compatibility and timing parameters for exact replacements. For alternatives, check Micron's cross-reference or distributor databases.
Pinout
The MT62F4G32D8DV-023 WT:C is a 4Gb (32Mx8) LPDDR4X SDRAM chip from Micron.
- Pin Count: 200-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- 8-bit data bus (x8 organization).
- LPDDR4X interface (low-power, high-speed, up to 4266 Mbps).
- 1.1V core voltage (VDD/VDDQ) for reduced power consumption.
- On-die termination (ODT) and programmable CAS latency for signal integrity.
- Bank architecture: 8 banks for efficient memory access.
Used in mobile devices, tablets, and embedded systems for compact, high-performance memory.
- Pin Count: 200-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- 8-bit data bus (x8 organization).
- LPDDR4X interface (low-power, high-speed, up to 4266 Mbps).
- 1.1V core voltage (VDD/VDDQ) for reduced power consumption.
- On-die termination (ODT) and programmable CAS latency for signal integrity.
- Bank architecture: 8 banks for efficient memory access.
Used in mobile devices, tablets, and embedded systems for compact, high-performance memory.
Package
The MT62F4G32D8DV-023 WT:C is a LPDDR4X SDRAM memory package. It features a 200-ball FBGA (Fine-pitch Ball Grid Array) package type, designed for high-speed, low-power applications in mobile and embedded systems. The "WT:C" suffix typically denotes specific speed, temperature, or other variant details. For exact specs, refer to Micron's datasheet.
