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MT48LC16M16A2P-7E:G
+NomenclatureIC DRAM 256MBIT PAR 54TSOP II
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FabricantMicron Technology Co., Ltd.
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Pièce fabricant #MT48LC16M16A2P-7E:G
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En stock3478
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Base Product Number | MT48LC16M16A2 |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM |
| Memory Size | 256Mbit |
| Memory Organization | 16M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 14ns |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 54-TSOP (0.400", 10.16mm Width) |
| Supplier Device Package | 54-TSOP II |
| Packaging | Tray |
| Access Time | 5.4 ns |
Présentation
Description
This SDRAM operates at a standard voltage of 3.3 volts and is compatible with a wide range of environments thanks to its robust design. It features a burst mode operation for more efficient data handling and supports various functionalities such as auto-refresh and self-refresh, crucial for maintaining data integrity and reducing power consumption.
Overall, the MT48LC16M16A2P-7E:G is suitable for applications that require reliable and fast memory, such as computers, networking equipment, and consumer electronics.
Equivalent
Features
1. Speed and Performance: It operates at a clock frequency of up to 143 MHz, with a CAS latency of 2 or 3, which allows for fast data access.
2. Voltage: The device requires a power supply voltage of 3.3V.
3. Configuration: It consists of 4 banks, each with a bank size of 4M x 16 bits, enabling efficient data management and access.
4. Burst Mode: Supports burst lengths of 1, 2, 4, 8, or a full page, with burst termination options.
5. Auto-refresh: Includes auto and self-refresh modes to maintain data integrity, with a refresh rate of 4,096 cycles in 64ms.
6. Packaging: Available in a 54-pin TSOP (Thin Small Outline Package), suitable for surface-mount applications.
7. Applications: Ideal for use in computing and networking devices, such as desktop computers, laptops, and routers, where high-speed memory is crucial.
Pinout
1. Addressing: It has address pins for accessing rows and columns within the memory array.
2. Data I/O: There are 16 data pins (DQ0-DQ15) that facilitate data input/output over the 16-bit data bus.
3. Control Signals: These include CS# (Chip Select), RAS# (Row Address Strobe), CAS# (Column Address Strobe), and WE# (Write Enable) which manage read/write operations.
4. Clock Input: The CLK pin is used to synchronize operations.
5. Power Pins: VDD and VSS pins supply the power and ground to the device.
6. Other Functions: The LDQM and UDQM pins are used for input/output masking, and the CKE pin is used for clock enable control.
This DRAM is utilized in applications requiring volatile memory storage, such as in computing and consumer electronics, due to its speed and capacity.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory size and organization of the MT48LC16M16A2P-7E:G?
A: It has a 256Mbit memory size organized as 16M x 16 (16 Megawords by 16 bits), suitable for 16-bit data bus applications.
Q: What is the maximum clock frequency supported by this SDRAM?
A: The device supports a clock frequency of 133 MHz, enabling high-speed data transfers for parallel interface memory systems.
Q: What is the voltage supply range required for operation?
A: It requires a supply voltage of 3V to 3.6V, compatible with standard 3.3V logic in embedded systems.
Q: What is the access time and write cycle time for this DRAM?
A: The access time is 5.4 ns, and the write cycle time for word/page operations is 14ns, ensuring efficient read/write performance.
Q: What package type does the MT48LC16M16A2P-7E:G use?
A: It comes in a 54-TSOP II package (0.400 inch width, 10.16mm), surface mount, suitable for space-constrained PCB designs.
Q: Is this component lead-free and RoHS compliant?
A: RoHS compliance is not specified in the provided parameters; please verify with the manufacturer for current environmental compliance status.
Q: What is the operating temperature range for this memory chip?
A: It operates within 0°C to 70°C (TA), typical for commercial-grade memory components in non-industrial environments.