MT47H256M8EB-25EIT:C

The MT47H256M8EB-25EIT:C is a 2Gb (256M x 8) DDR3 SDRAM memory chip manufactured by Micron Technology. It operates at a 1.5V supply voltage and is designed for high-performance applications, such as computing and telecommunications. This DDR3 memory is characterized by its high speed, supporting data rates of 800 MT/s to 1600 MT/s.
The chip features a x8 data width and adheres to the JEDEC standard for DDR3 memory modules. It includes advanced power-saving features, such as self-refresh and deep power-down modes, making it suitable for devices where energy efficiency is crucial.
The part number suffix "C" indicates a commercial temperature range, ensuring reliability in typical operational conditions. The MT47H256M8EB-25EIT:C is commonly used in various applications, including laptops, desktops, and embedded systems, where robust memory performance is required. Its compact design and efficiency contribute to its popularity in the market.

The MT47H256M8EB-25EIT:C chip is a DDR3 SDRAM memory device with a 256MB capacity and a x8 data width. Equivalent products include parts from manufacturers like Samsung (K4B4G1646D), Micron (MT41K256M16HA), and Hynix (H5TQ1G83AFR). Always verify specifications like speed, voltage, and package type for compatibility.

The MT47H256M8EB-25EIT:C is a DRAM memory chip produced by Micron Technology. It features:
1. Density: 256 Megabits (32 Megabytes) per chip.
2. Configuration: 8 bits x 32, which indicates it has a wide data bus.
3. Type: DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic RAM).
4. Speed: Operates at a clock speed of 800 MT/s (megatransfers per second).
5. Voltage: Typically operates at a supply voltage of 1.5V, suitable for energy-efficient applications.
6. Package Type: Available in a compact 78-ball BGA (Ball Grid Array) package, facilitating dense mounting on PCBs.
7. Operating Temperature: Commercial grade (-40°C to +85°C).
This chip is commonly used in various applications, including consumer electronics, embedded systems, and industrial devices, due to its performance and efficiency.

The MT47H256M8EB-25EIT:C is a 256Mb DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip. It features a total of 84 pins.
The primary functions of these pins include:
- Data Pins (DQ0-DQ7): Used for data input and output.
- Address Pins (A0-A12, BA0-BA1): Used for addressing the memory locations.
- Control Pins: Including CS (Chip Select), RAS (Row Address Strobe), CAS (Column Address Strobe), WE (Write Enable), and CKE (Clock Enable) for controlling memory operations.
- Clock Pins (CLK, CLK#): For synchronization of data transfers.
- Power and Ground Pins (VDD, VSS): Provide power supply and ground connections.
This memory chip operates at a speed of 1066 MT/s and is designed for applications requiring high performance and low power consumption.

The manufacturer of the MT47H256M8EB-25EIT:C is Micron Technology, Inc. Micron is a leading American semiconductor company specializing in memory and storage solutions, including DRAM, NAND flash memory, and SSDs. Founded in 1978 and headquartered in Boise, Idaho, Micron plays a significant role in the global semiconductor industry. The company primarily serves various markets, including consumer electronics, computing, mobile devices, automotive, and data centers, providing high-performance memory products that are essential for modern computing and data processing applications. Micron is recognized for its innovation and commitment to advancing memory technology, making it a key player in the development of next-generation memory solutions.

The MT47H256M8EB-25EIT:C is a DDR3 SDRAM memory chip primarily used in high-performance applications. Its application areas include:
1. Consumer Electronics: Used in smartphones, tablets, and laptops for efficient data processing.
2. Networking Equipment: Utilized in routers and switches for fast data transfer.
3. Gaming Consoles: Provides high-speed memory for graphics and processing.
4. Servers: Employed in data centers for improved memory performance in cloud computing and virtual servers.
5. Industrial Applications: Supports automation systems and embedded devices requiring reliable memory solutions.
These applications benefit from its speed, efficiency, and reliability.

The MT47H256M8EB-25EIT:C is packaged in a 78-ball FBGA (Fine Ball Grid Array) format, which is commonly used for memory devices.