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MT40A4G4JC-062E:E
+NomenclatureIC DRAM 16GBIT POD 78FBGA
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FabricantMicron Technology Co., Ltd.
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Pièce fabricant #MT40A4G4JC-062E:E
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En stock16916
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Base Product Number | MT40A4G4 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR4 |
| Memory Size | 16Gbit |
| Memory Organization | 4G x 4 |
| Memory Interface | POD |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package | 78-TFBGA |
| Supplier Device Package | 78-FBGA (9x11) |
| Packaging | Box |
| Access Time | 19 ns |
Présentation
Description
MT40A4G4JC-062E:E is a Micron DDR3 SDRAM device. It comes from the MT40A4G4JC family, representing a 4‑Gbit density with a x4 data‑width per device, intended for use on memory modules (DIMMs/SODIMMs) in desktops, laptops, or servers. The 062E portion indicates a specific speed grade/revision, and the trailing :E typically denotes an extended-temperature variant in Micron’s catalog.
Key points:
- Type: DDR3 SDRAM, standard memory sub-system component.
- Density/organization: 4 Gbit per die, x4 data width.
- Temperature/variant: -E indicates extended-temperature (industrial/temperate ranges are supported in some parts).
- Typical use: memory sub-system within DIMMs/SODIMMs.
- Electrical: usually 1.5V DDR3 (with some variants offering 1.35V DDR3L); exact specs and timings are in the official Micron datasheet for MT40A4G4JC-062E:E.
For precise electrical specs, timings, packaging, and temperature range, consult Micron’s datasheet.
Key points:
- Type: DDR3 SDRAM, standard memory sub-system component.
- Density/organization: 4 Gbit per die, x4 data width.
- Temperature/variant: -E indicates extended-temperature (industrial/temperate ranges are supported in some parts).
- Typical use: memory sub-system within DIMMs/SODIMMs.
- Electrical: usually 1.5V DDR3 (with some variants offering 1.35V DDR3L); exact specs and timings are in the official Micron datasheet for MT40A4G4JC-062E:E.
For precise electrical specs, timings, packaging, and temperature range, consult Micron’s datasheet.
Features
MT40A4G4JC-062E:E is a Micron DDR3 SDRAM device. Key features:
- Density/Width: 4 Gb per die, x4 data width
- Organization: DDR3 SDRAM with 8 banks
- Interface: 8n prefetch, burst length 8
- Speed: up to DDR3-1333 MT/s (PC3-10600) grade
- Voltage: 1.5 V (DDR3 standard)
- JEDEC compliant
- Temperature option: extended-temperature variant available (-E)
- Package: typical 96-ball FBGA (per Micron packaging options)
- Applications: used in memory subsystems/modules requiring DDR3 performance
Note: exact speed grades and packaging can vary by lot; the -E suffix indicates the extended-temperature variant.
- Density/Width: 4 Gb per die, x4 data width
- Organization: DDR3 SDRAM with 8 banks
- Interface: 8n prefetch, burst length 8
- Speed: up to DDR3-1333 MT/s (PC3-10600) grade
- Voltage: 1.5 V (DDR3 standard)
- JEDEC compliant
- Temperature option: extended-temperature variant available (-E)
- Package: typical 96-ball FBGA (per Micron packaging options)
- Applications: used in memory subsystems/modules requiring DDR3 performance
Note: exact speed grades and packaging can vary by lot; the -E suffix indicates the extended-temperature variant.
Pinout
- Pin count: 96-ball BGA (96-pin package)
- Function: Micron MT40A4G4JC-062E:E is a DDR3-type SDRAM memory device with x4 data width (4Gbit density per device), used as a single memory chip in memory modules.
- Function: Micron MT40A4G4JC-062E:E is a DDR3-type SDRAM memory device with x4 data width (4Gbit density per device), used as a single memory chip in memory modules.
Manufacturer
- Manufacturer: Micron Technology, Inc.
- Type of company: An American multinational semiconductor company that designs and manufactures memory and storage products (DRAM, NAND flash, etc.) for computing, servers, and consumer devices.
- Type of company: An American multinational semiconductor company that designs and manufactures memory and storage products (DRAM, NAND flash, etc.) for computing, servers, and consumer devices.
Application
MT40A4G4JC-062E:E is a Micron high-density DRAM device. Typical application areas include:
- Data-center servers, blade servers, and high-end workstations
- Networking equipment (routers, switches) and telecom gear
- Storage controllers, RAID cards, and cache memory
- Embedded and industrial systems (automation controllers, industrial PCs)
- Automotive electronics and robotics requiring rugged, dense memory
- Consumer electronics with substantial memory needs (set-top boxes, gaming consoles)
- Data-center servers, blade servers, and high-end workstations
- Networking equipment (routers, switches) and telecom gear
- Storage controllers, RAID cards, and cache memory
- Embedded and industrial systems (automation controllers, industrial PCs)
- Automotive electronics and robotics requiring rugged, dense memory
- Consumer electronics with substantial memory needs (set-top boxes, gaming consoles)
Package
96-ball Fine-Pitch FBGA (FBGA96) package.
