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MT29F2G08ABAEAH4-ITX:E
+NomenclatureIC FLASH 2GBIT PARALLEL 63VFBGA
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FabricantMicron Technology Co., Ltd.
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Pièce fabricant #MT29F2G08ABAEAH4-ITX:E
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En stock4561
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Base Product Number | MT29F2G08 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Packaging | Tray |
Présentation
Description
The chip features an 8-bit interface, making it compatible with various microcontrollers and embedded systems. It's designed for industrial temperature ranges, thus suitable for harsh environments, with a temperature range typically from -40°C to +85°C. This makes it ideal for applications in automotive, industrial automation, and other demanding sectors.
The MT29F2G08ABAEAH4-ITX:E supports advanced error correction code (ECC), wear leveling, and bad block management to ensure data integrity and longevity. Its compact TSOP (Thin Small Outline Package) enhances its versatility for space-constrained applications, providing a robust solution for non-volatile data storage needs.
Equivalent
1. Samsung: K9F2G08U0C
2. Toshiba: TC58NVG2S3HTA00
3. SK Hynix: H27U2G8F2BTR
4. Kioxia: TH58NVG2S3HTA00
These chips have similar specifications in terms of capacity, interface, and performance, making them suitable alternatives. Always check detailed specs to ensure compatibility.
Features
1. Capacity: 2Gb (gigabit), organized as 256 blocks with 64 pages per block, and 2112 bytes per page.
2. Interface: Uses an 8-bit I/O interface for data transfer.
3. Performance: Features fast read and write capabilities with a page read time of 25 microseconds and a typical write time of 200 microseconds per page.
4. Endurance: Offers robust endurance capable of withstanding multiple program/erase cycles.
5. Voltage Range: Operates within a voltage range of 2.7 to 3.6 volts.
6. Temperature: Designed for industrial temperature ranges, operating between -40°C to +85°C.
7. Packaging: Available in a TSOP (Thin Small Outline Package) for space-efficient board design.
8. Error Correction: Supports ECC (Error Correction Code) to enhance data integrity.
9. Applications: Suitable for use in embedded systems, industrial applications, and consumer electronics.
These features make the MT29F2G08ABAEAH4-ITX:E a reliable choice for various applications requiring non-volatile storage.
Pinout
- Pin Count: Typically, NAND Flash memory chips like this one come in a 48-pin TSOP or 63-ball BGA package. The exact configuration depends on the specific package type.
- Functions:
- Data Storage: Non-volatile storage for a wide range of applications, maintaining data without power.
- I/O Interface: Includes pins for data input/output, command, and address inputs, typically supporting an 8-bit data bus.
- Control Signals: Contains pins for control signals such as Chip Enable (CE#), Write Enable (WE#), Read Enable (RE#), Command Latch Enable (CLE), Address Latch Enable (ALE), and Ready/Busy (R/B#).
- Power: Pins for Vcc (core supply voltage) and Vss (ground).
These pins and functions enable the MT29F2G08ABAEAH4-ITX:E to perform efficiently as a storage solution in various electronic devices.
Manufacturer
Micron, headquartered in Boise, Idaho, is recognized for its innovation in memory technologies and plays a critical role in the development of advanced memory and storage solutions. The company's products are pivotal in enabling the functionality of modern electronic devices, such as computers, smartphones, and data centers, by providing the necessary storage and memory capabilities.
In addition to its manufacturing operations, Micron is involved in extensive research and development activities to advance memory technology and improve the performance and efficiency of its products. As a key player in the semiconductor industry, Micron has a significant impact on the technological advancements that drive the digital world.
Application
Package
Frequently Asked Questions
Q: Is the MT29F2G08ABAEAH4-ITX:E suitable for industrial temperature ranges?
A: Yes, it operates from -40°C to 85°C, making it ideal for industrial-grade designs requiring extended temperature endurance.
Q: What is the memory density and interface type of this NAND Flash?
A: It has 2Gbit (256M x 8) capacity with a parallel interface, supporting standard NAND flash command protocol.
Q: What voltage supply does this component require?
A: It requires a single power supply from 2.7V to 3.6V, compatible with common 3.3V logic systems.
Q: Can this part be used in new designs or is it obsolete?
A: The part status is "Obsolete," so it is not recommended for new designs; use only for replacement or legacy support.
Q: What package option is available for this device?
A: It comes in a 63-VFBGA (9x11mm) surface-mount package, optimized for space-constrained PCB layouts.
Q: Is the memory pre-assembled in tray packaging?
A: Yes, it is shipped in tray packaging, suitable for manual or automated pick-and-place assembly.
Q: What is the memory organization of the MT29F2G08ABAEAH4?
A: It is organized as 256M x 8 bits, providing byte-addressable access via the parallel interface.
