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MT29F1G08ABAEAH4-IT:E
+NomenclatureIC FLASH 1GBIT PARALLEL 63VFBGA
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FabricantMicron Technology Co., Ltd.
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Pièce fabricant #MT29F1G08ABAEAH4-IT:E
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Package 63-VFBGA
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En stock3917
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Spécifications
| Attribut | Valeur |
| Package | Bulk |
| ProductStatus | Obsolete |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 1Gb (128M x 8) |
| MemoryInterface | Parallel |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
Présentation
Description
Equivalent
- Samsung K9F1G08U0D
- Winbond W25N01GV
Note: not necessarily drop-in; verify pinout, voltages, page size, and ONFI revision from datasheets and use a cross-reference tool.
Features
- Density: 1 Gbit (128 MB) NAND flash
- Interface: x8 I/O, ONFi-compatible
- Organization: 2 KB page size with 64-byte OOB; multi-plane/interleaved
- Performance features: cache program, copy-back, random data read
- Reliability: built-in ECC support (BCH), robust bad-block management
- Endurance: typical P/E cycles in the 1e4–1e5 range (MLC)
- Voltage: 3.3 V nominal
- Temperature: Industrial range, -40°C to 85°C
- Packaging: standard NAND package (typical TSOP/FBGA)
Note: exact page/OOB sizes, block structure, and speed spec may vary by revision; consult the datasheet for precise parameters.
Pinout
- Function: Micron MT29F1G08ABAEAH4-IT:E is a 1 Gbit NAND flash memory with an 8-bit data bus. It provides non-volatile storage using the standard NAND interface: DQ0–DQ7 data I/O, multiplexed address/command inputs (A0–A10 with ALE/CLE), control signals (CE, WE, RE, WP), Ready/Busy (R/B), and power pins (Vcc/Vss).
Manufacturer
- What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage solutions (DRAM, NAND flash, NOR flash) and related products for computing, mobile, enterprise, and consumer markets. It is one of the world's largest memory manufacturers.
Application
- Embedded non-volatile storage in consumer electronics (cameras, tablets, wearables), USB drives, memory cards, set-top boxes
- Automotive systems (infotainment, telematics, instrument clusters) requiring wide-temp reliability
- Industrial equipment (PLCs, data loggers, routers, rugged IoT devices)
- Embedded firmware/data storage for MCU/SoC-based designs, smart meters, networking gear
- NAND memory component in cost-sensitive subsystems (eMMC/SSD modules)