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MLZ2012N4R7LT000
+NomenclatureFIXED IND 4.7UH 600MA 180MOHM SM
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FabricantSociété TDK
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Pièce fabricant #MLZ2012N4R7LT000
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Fiche technique MLZ2012N4R7LT000 DataSheet
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En stock8813
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Spécifications
| Attribut | Valeur |
| Series | MLZ |
| PartStatus | Active |
| Type | Multilayer |
| Material-Core | Ferrite |
| Inductance | 4.7 µH |
| Tolerance | ±20% |
| CurrentRating(Amps) | 600 mA |
| Current-Saturation(Isat) | 130mA |
| Shielding | Shielded |
| DCResistance(DCR) | 180mOhm |
| Frequency-SelfResonant | 70MHz |
| OperatingTemperature | -55°C ~ 125°C |
| InductanceFrequency-Test | 2 MHz |
| MountingType | Surface Mount |
| Package/Case | 0805 (2012 Metric) |
| SupplierDevicePackage | 0805 (2012 Metric) |
| Size/Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Height-Seated(Max) | 0.041" (1.05mm) |
Présentation
Description
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Equivalent
1. Murata GRM21BR71H475KA01L
2. TDK C2012X5R1H475K125AB
3. KEMET C2012X7R1H475K125AB
Always verify specifications like tolerance, temperature coefficient, and size to ensure compatibility.
Features
1. Inductance Value: 4.7 µH, suitable for filtering and energy storage applications.
2. Current Rating: Capable of handling high currents, which varies by specific design and environmental conditions.
3. DC Resistance (DCR): Low DCR, minimizing power loss during operation.
4. Size: Compact 2012 (2.0 x 1.2 mm) footprint, ideal for space-constrained designs.
5. Temperature Range: Operates effectively across a wide temperature range, ensuring reliability in varying conditions.
6. Shielded Design: Reduces electromagnetic interference (EMI) for improved performance in sensitive applications.
7. Applications: Commonly used in power management circuits, DC-DC converters, and RF applications.
These features make the MLZ2012N4R7LT000 a versatile choice for modern electronic designs requiring efficient inductive components.
Pinout
This component is commonly used in circuits to stabilize voltage and reduce noise, enhancing the performance and reliability of electronic devices. The MLZ2012N4R7LT000 is packaged in a compact size, allowing for efficient space utilization on printed circuit boards (PCBs).