MCIMX6L2DVN10AB

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MCIMX6L2DVN10AB

+Nomenclature

IC MPU I.MX6 1GHZ 432MAPBGA

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Spécifications

Attribut Valeur
Series i.MX6
Part Status Active
Core Processor ARM® Cortex®-A9
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 1GHz
Co - Processors / DSP Multimedia; NEON™ SIMD
RAM Controllers DDR3, LPDDR2
Graphics Acceleration Yes
Display & Interface Controllers LCD
Ethernet 10/100Mbps (1)
USB USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage - I / O 1.2V, 1.8V, 3V
Operating Temperature 0°C ~ 95°C (TJ)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type Surface Mount
Package / Case 432-TFBGA
Supplier Device Package 432-MAPBGA (13x13)
Additional Interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

Présentation

Description

The MCIMX6L2DVN10AB is part of NXP's i.MX 6SoloLite family, which is a series of applications processors designed for cost-effective, high-performance solutions. This particular model is built around an ARM Cortex-A9 core, offering a balance of efficient processing power and energy consumption, making it suitable for embedded systems. It operates at speeds up to 1 GHz, supporting a wide array of multimedia applications including audio and video processing.
The processor is equipped with an integrated graphics processing unit, support for 2D graphics acceleration, and a variety of interfaces for connectivity such as USB, UART, I2C, and SPI. Its power management features and low power modes make it ideal for battery-operated devices. The MCIMX6L2DVN10AB is also engineered to handle robust operating systems and complex applications, thus catering to industries like automotive, consumer electronics, and industrial automation. Additionally, it supports various memory types, including DDR3 and LPDDR2, enhancing its versatility for different application needs.

Equivalent

The MCIMX6L2DVN10AB is part of NXP's i.MX 6 series. Equivalent products with similar processing capabilities often come from the same family or similar lines by other manufacturers, like TI's Sitara series or Broadcom's BCM2835 (used in Raspberry Pi). However, when seeking direct equivalents, consider the i.MX 6Solo or 6DualLite versions for alternatives with similar architecture and performance within NXP's offerings. Always verify compatibility with your application requirements.

Features

The MCIMX6L2DVN10AB is a part of the i.MX 6SoloLite series from NXP Semiconductors, designed for cost-effective and power-efficient processing solutions. Its key features include:
1. Processor Core: Features a single ARM Cortex-A9 core, providing a balance of performance and power efficiency, ideal for media-rich applications.

2. Graphics: Equipped with a 2D graphics processing unit (GPU) for efficient rendering of graphical interfaces and basic multimedia functionality.
3. Memory Support: Supports a variety of memory types, including DDR3, LPDDR2, and NOR flash, allowing flexible memory configurations to suit different application needs.
4. Connectivity: Comes with a range of interfaces including UART, I2C, SPI, and USB for versatile peripheral integration.
5. Display Support: Capable of driving displays with integrated support for LCD interfaces, making it suitable for user-interface-centric applications.
6. Power Management: Designed for optimized power usage with low-power modes, essential for battery-powered devices.
7. Temperature Range: Available in industrial temperature ranges, making it suitable for various environmental conditions.
This chip is ideal for applications in areas like e-readers, industrial control, and smart home devices.

Pinout

The MCIMX6L2DVN10AB is part of the i.MX 6SoloLite family of applications processors by NXP. It features a 289-pin package. The i.MX 6SoloLite processors are designed for applications requiring high performance and energy efficiency, utilizing ARM Cortex-A9 cores.
Key functions of the MCIMX6L2DVN10AB include:
- High-performance processing capabilities with a single ARM Cortex-A9 core.
- Integrated 2D graphics acceleration for enhanced visual applications.
- Support for a variety of external memory interfaces, including DDR3 and LPDDR2.
- Multiple connectivity options such as USB, UART, SPI, I2C, and GPIOs.
- Integrated display controllers for either LCD or EPD (E-paper displays), suitable for cost-sensitive applications that require advanced user interfaces.
This processor is typically chosen for applications in consumer electronics, industrial devices, and embedded systems where display and connectivity are crucial.

Manufacturer

The MCIMX6L2DVN10AB is manufactured by NXP Semiconductors. NXP is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in producing a wide range of semiconductor products, including microcontrollers, processors, sensors, and integrated circuits, which are used in automotive, industrial, mobile, and communication infrastructure applications. NXP is known for its innovation in areas such as secure connectivity solutions for embedded applications and has a significant presence in the automotive and Internet of Things (IoT) markets.

Application

The MCIMX6L2DVN10AB, part of the i.MX 6 series from NXP, is a versatile processor used in various applications. Its primary application areas include industrial automation, where it helps manage and control machinery; consumer electronics, powering smart home devices and multimedia systems; and automotive infotainment, providing interactive and navigational features. Additionally, it is used in healthcare devices for patient monitoring systems and in retail for point-of-sale terminals. The processor's robust multimedia capabilities make it suitable for user interfaces in embedded systems, while its power efficiency supports portable devices.

Package

The MCIMX6L2DVN10AB is a microprocessor from NXP's i.MX 6 series, typically housed in a 400-pin MAPBGA (Molded Array Process Ball Grid Array) package. This package type is designed for compact integration in embedded systems, providing efficient thermal performance and high interconnect density.

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