MC56F8365MFGE

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MC56F8365MFGE

+Nomenclature

IC MCU 16BIT 512KB FLASH 128LQFP

  • FabricantNXP USA Inc.

  • Pièce fabricant #MC56F8365MFGE

  • Package 128-LQFP

  • En stock2170

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Spécifications

Attribut Valeur
Supplier NXP USA Inc.
Package Tray
Series 56F8xxx
ProductStatus Active
CoreProcessor 56800E
CoreSize 16-Bit
Speed 60MHz
Connectivity CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT
NumberofI/O 49
ProgramMemorySize 512KB (256K x 16)
ProgramMemoryType FLASH
RAMSize 18K x 16
Voltage-Supply(Vcc/Vdd) 2.25V ~ 3.6V
DataConverters A/D 16x12b
OscillatorType External
OperatingTemperature -40°C ~ 125°C (TA)
MountingType Surface Mount
Package/Case 128-LQFP

Présentation

Description

Introduction to MC56F8365MFGE
- What it is: A Freescale/NXP DSP56F83xx family microcontroller, a 32-bit fixed-point DSP MCU optimized for real-time DSP and motor-control tasks.
- Core: Efficient DSP core with multiple MAC units and Harvard architecture, designed for high-throughput DSP operations.
- Memory and peripherals: On-chip flash and RAM, plus peripherals such as ADCs, PWM outputs, timers, and serial interfaces (SCI, SPI, I2C); automotive-grade options often available.
- Package/variant: Suffix MFGE denotes specific package type and temperature/revision grade.
- Applications and tools: Suited for motor control, power electronics, and audio DSP; supported by NXP development tools and documentation (datasheet, reference manuals, application notes).
For precise specs (pinout, memory size, peripherals, timing), consult the official MC56F8365MFGE datasheet and user guide.

Equivalent

There isn’t a single official one-to-one cross for MC56F8365MFGE. Closest replacements are other Freescale/NXP 56F8 DSP MCU family parts with similar speed and peripherals (e.g., variants in the 56F83x/56F84x/56F86x lines), but exact pinout and memory differ. To provide precise equivalents, please share required speed, flash/RAM, peripherals (CAN, ADC, USB, DMA), and package. I can then propose pin-compatible or feature-m matched cross references.

Features

MC56F8365MFGE features (concise):
- Core: Freescale ColdFire 32-bit RISC CPU with integrated DSP MAC engine (DSP-oriented performance).
- Speed: Up to about 60 MHz operation for high MIPS/DSP throughput.
- Memory: On-chip program Flash and data RAM (size varies by variant); supports external memory interface.
- Analog: Multiple 12-bit ADC channels (and sometimes DAC per variant) for sensor interfacing.
- Timers/PWM: Advanced timer/counter modules and PWM outputs suitable for motor control and waveform generation.
- Serial peripherals: SCI (USART), SPI, and I2C interfaces for communication.
- DMA/Bus: Direct Memory Access controller to move data efficiently.
- Debug/Programming: On-chip debug (BDM) and JTAG support for development; boot/utility support.
- Safety/Utility: CRC, watchdog timer, and other system-management features.
- Power: Low-power modes with fast wake-up.
- Packaging: Available in common Freescale/NXP packages (e.g., LQFP/BGA options) with RoHS-compliant variants.
Note: Exact memory sizes and peripheral counts vary by package/configuration of MC56F8365MFGE. For precise specs, refer to the datasheet.

Pinout

- Pin count: 80 pins (LQFP package)
- Function: 16-bit DSP-based microcontroller (DSP56F family) with on-chip flash RAM and DSP peripherals for motor control/industrial applications (DSP core with multiple ADCs, PWM, timers, and serial interfaces).

Manufacturer

Manufacturer: NXP Semiconductors (the former Freescale Semiconductor).
What kind of company: NXP is a Dutch multinational semiconductor company that designs, manufactures, and markets integrated circuits and embedded solutions for automotive, industrial, mobile, and consumer electronics.

Application

Applications of the MC56F8365MFGE include:
- Motor control and drive systems (BLDC, PMSM, servo drives)
- Automotive electronics and powertrain controllers
- Industrial automation and process control (inverters, precision drives)
- Digital power electronics and power-supply control (PWM-based SMPS/inverters)
- Instrumentation, sensing, and DSP-based data acquisition and signal processing in embedded systems

Package

Plastic LQFP (Low-Profile Quad Flat Pack) package.

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