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MBC13917EPR2
+NomenclatureIC AMP GP 100MHZ-2.5GHZ 6MLPD EP
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FabricantNXP USA Inc.
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Pièce fabricant #MBC13917EPR2
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Fiche technique MBC13917EPR2 DataSheet
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Package 6-UFDFN Exposed Pad
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En stock6808
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Spécifications
| Attribut | Valeur |
| Supplier | NXP USA Inc. |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Obsolete |
| Frequency | 100MHz ~ 2.5GHz |
| P1dB | -1.1dB |
| Gain | 14.9dB |
| NoiseFigure | 1.8dB |
| RFType | General Purpose |
| Voltage-Supply | 2.1V ~ 3.3V |
| Current-Supply | 20mA |
| TestFrequency | 1.9GHz |
| MountingType | Surface Mount |
| Package/Case | 6-UFDFN Exposed Pad |
Présentation
Description
Equivalent
Features
1. Frequency Range: Designed to support frequencies commonly used in RF applications.
2. Power Output: Provides high power output suitable for amplifying signals in communication devices.
3. Efficiency: Optimized for high efficiency to ensure minimal power loss and heat generation.
4. Linearity: Features high linearity, essential for maintaining signal integrity in communications.
5. Compact Package: Comes in a compact package, making it suitable for space-constrained applications.
6. Thermal Management: Includes features for effective thermal management to enhance performance and reliability.
7. Integration: Offers a high level of integration, reducing the need for external components.
8. Reliability: Manufactured to meet rigorous quality standards for long-term reliability in various environmental conditions.
This IC is often used in base stations, repeaters, and similar equipment, where efficient and reliable power amplification is critical.
Pinout
1. RF_IN: RF input signal.
2. RF_OUT: RF output signal.
3. VCC: Supply voltage pin for powering the device.
4. GND: Ground connections for stabilizing the circuit.
5. BIAS: Used for biasing the amplifier.
6. NC or DNU: No Connect or Do Not Use pins which are usually not internally connected.
These are typical functions, but exact details should be confirmed from the manufacturer's datasheet to ensure accuracy and compatibility with your specific application.
Manufacturer
Application
1. Base Stations: Enhances signal strength and reliability for cellular networks, including 4G and 5G infrastructures.
2. Wireless Transmitters: Used in various communication equipment to boost signal transmission.
3. Broadcast Systems: Supports radio and television broadcasting by amplifying signals for broader reach.
4. Military and Defense: Utilized in secure communication devices for robust and long-range signal transmission.
5. Industrial Applications: Used in IoT devices and systems requiring efficient power amplification for connectivity.
These applications benefit from the module's efficiency, linearity, and power output capabilities.