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M393A2K40EB3-CWE
+Nomenclature-
FabricantSamsung Electronics
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Pièce fabricant #M393A2K40EB3-CWE
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En stock23570
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Spécifications
| Attribut | Valeur |
| EU RoHS | Compliant with Exemption |
| ECCN (US) | 4A994a. |
| Part Status | Active |
| HTS | 8473.30.11.40 |
| Automotive | No |
| PPAP | No |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Mounting | Socket |
| SVHC | Yes |
| Module | DRAM Module |
| Subcategory | DDR4 SDRAM |
| Module Density | 16Gbyte |
| Organization | 2Gx72 |
| Module Type | 288RDIMM |
| Number of Chip per Module | 18 |
| Chip Density (bit) | 8G |
| Data Bus Width (bit) | 72 |
| Max. Access Time (ns) | 0.16 |
| Maximum Clock Rate (MHz) | 3200 |
| Chip Configuration | 2Gx4 |
| Chip Package Type | 78FBGA |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Typical Operating Supply Voltage (V) | 1.2 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| Operating Current (mA) | 1918 |
| Supplier Temperature Grade | Commercial |
| Module Sides | Double |
| ECC Support | No |
| Number of Ranks | Single |
| Number of Chip Banks | 16 |
| CAS Latency | 22 |
| PLL | No |
| SPD EEPROM Support | No |
| Self Refresh | Yes |
| Package Height | 31.25 |
| Package Width | 4.1(Max) |
| Package Length | 133.35 |
| PCB changed | 288 |
| Standard Package Name | DIMM |
| Supplier Package | RDIMM |
| Pin Count | 288 |
Présentation
Description
DRAM modules like this one are critical for providing the necessary memory that allows servers to efficiently process and store data. The letters and numbers in the part number indicate specific characteristics: for example, "M393" often denotes a Samsung memory module, while the rest of the sequence may provide information about its size (such as 16GB or 32GB), speed (measured in MHz), and other technical specifications like error-correcting code (ECC) capabilities.
In summary, the M393A2K40EB3-CWE is a highly specific type of server memory module designed for reliability and performance in demanding computing environments.
Equivalent
1. Hynix HMA82GR7AJR8N-WM
2. Micron MTA18ASF2G72PZ-3G2R
3. Kingston KSM26RD8/16HD
These modules have similar specifications, such as speed, capacity, and form factor, and are commonly used in server environments.
Features
1. Memory Type: DDR4 SDRAM, which offers higher performance and improved power efficiency compared to its predecessors.
2. Capacity: 16GB, suitable for demanding applications and multitasking environments.
3. Speed: Operates at a data rate of 2400 MT/s, providing fast data transfer rates.
4. Form Factor: RDIMM, which includes a register for improved stability and performance, making it ideal for server and workstation environments.
5. Voltage: 1.2V, which contributes to lower power consumption and heat generation.
6. Error Correction: Equipped with ECC (Error-Correcting Code) for detecting and correcting data corruption, enhancing reliability for critical applications.
7. Compatibility: Typically used in servers and high-performance workstations that require robust and stable memory solutions.
These features make the M393A2K40EB3-CWE a reliable choice for enterprise-level computing needs, where performance and data integrity are crucial.
Pinout
The module follows the standard DDR4 DIMM configuration which typically has 288 pins. The primary functions of this RDIMM include high-speed data transfer, improved efficiency, and reduced power consumption compared to DDR3. It supports ECC (Error-Correcting Code) for increased reliability in data integrity, which is critical in enterprise environments.
Key functionalities include:
- High density and performance, suitable for data centers and enterprise applications.
- Lower voltage operation (typically 1.2V for DDR4) for power efficiency.
- Use of TSV (Through-Silicon Via) for improved performance.
- Registered DIMMs include a register that helps in clock signal integrity and overall stability when used in systems with multiple DIMM slots.
This configuration enables it to support server workloads that require high data throughput and robust stability.
Manufacturer
Application
1. Data Centers: Enhances server performance for cloud computing, virtualization, and big data analytics.
2. Enterprise Servers: Supports mission-critical applications, ensuring reliability and high uptime.
3. High-Performance Computing (HPC): Facilitates complex computations and simulations in scientific and engineering applications.
4. Database Management: Improves database transaction processing and query performance.
5. Financial Services: Powers real-time analytics, risk management, and transaction processing.
6. Media and Entertainment: Supports video rendering, editing, and large-scale media storage.
These environments benefit from its error-correcting capability, high capacity, and reliable performance.